CAPACITOR PADS AND METHODS OF MANUFACTURING THE SAME
| Register | USPTO Patent |
|---|---|
| Application Number | 17448288 |
| Status | Pending |
| Filing Date | 2021-09-21 |
| First Publication Date | 2023-03-23 |
| Publication Date | 2023-03-23 |
| Owner | Intel Corporation (USA) |
| Inventor |
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Abstract
Capacitor pads and methods of manufacturing the same are disclosed herein. An example apparatus disclosed herein includes a substrate to support a die, and a die-side capacitor pad on the substrate, the die-side capacitor pad including a plurality of distinct pad portions, the distinct pad portions spaced apart from one another.IPC Classes ?
- H01L 23/498 - Leads on insulating substrates
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
- H01L 49/02 - Thin-film or thick-film devices