CAPACITOR PADS AND METHODS OF MANUFACTURING THE SAME
|First Publication Date||2023-03-23|
|Owner||Intel Corporation (USA)|
AbstractCapacitor pads and methods of manufacturing the same are disclosed herein. An example apparatus disclosed herein includes a substrate to support a die, and a die-side capacitor pad on the substrate, the die-side capacitor pad including a plurality of distinct pad portions, the distinct pad portions spaced apart from one another.
IPC Classes ?
- H01L 23/498 - Leads on insulating substrates
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
- H01L 49/02 - Thin-film or thick-film devices