METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES WITH NANO-ROUGHENED INTERCONNECTS
| Register | USPTO Patent |
|---|---|
| Application Number | 17448693 |
| Status | Pending |
| Filing Date | 2021-09-23 |
| First Publication Date | 2023-03-23 |
| Publication Date | 2023-03-23 |
| Owner | Intel Corporation (USA) |
| Inventor |
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Abstract
Methods, systems, apparatus, and articles of manufacture to produce nano-roughened integrated circuit packages are disclosed. An example integrated circuit (IC) package includes a substrate, a semiconductor die, and a metal interconnect to electrically couple the semiconductor die to the substrate, the metal interconnect including a nano-roughened surface.IPC Classes ?
- H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices