Register USPTO Patent
Application Number 17480420
Status Pending
Filing Date 2021-09-21
First Publication Date 2023-03-23
Publication Date 2023-03-23
Owner Intel Corporation (USA)
  • Moret, Eric J.M.
  • Tadayon, Pooya


In an optical circuit, a substrate can have a substrate top surface, a substrate bottom surface, and a substrate edge surface that extends around at least a portion of a perimeter of the substrate. A photonic integrated circuit (PIC) can be attached to the substrate. The PIC can have a PIC optical port that is configured to accept or emit an optical beam along a PIC optical axis. A lens can be located at the substrate edge surface. The substrate can include an optical path that extends through the substrate from a first substrate optical port that is aligned with the PIC optical axis to a second substrate optical port that faces the lens, such that an optical beam emergent from the PIC optical port can traverse the optical path and pass through the lens to emerge substantially parallel to the substrate top surface.

IPC Classes  ?

  • G02B 6/30 - Optical coupling means for use between fibre and thin-film device