DAM SURROUNDING A DIE ON A SUBSTRATE
|First Publication Date||2023-03-23|
|Owner||Intel Corporation (USA)|
AbstractEmbodiments described herein may be related to apparatuses, processes, and techniques for a dam structure on a substrate that is proximate to a die coupled with the substrate, where the dam decreases the risk of die shift during encapsulation material flow over the die during the manufacturing process. The dam structure may fully encircle the die. During encapsulation material flow, the dam structure creates a cavity that moderates the different flow rates of material that otherwise would exert different pressures the sides of the die and cause to die to shift its position on the substrate. Other embodiments may be described and/or claimed.
IPC Classes ?
- H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
- H01L 23/22 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device