GLASS SUBSTRATE EMBEDDED PIC TO PIC AND OFF-CHIP PHOTONIC COMMUNICATIONS

Register USPTO Patent
Application Number 17481266
Status Pending
Filing Date 2021-09-21
First Publication Date 2023-03-23
Publication Date 2023-03-23
Owner Intel Corporation (USA)
Inventor
  • Duong, Benjamin
  • Darmawikarta, Kristof
  • Pietambaram, Srinivas V.
  • Grujicic, Darko
  • Nie, Bai
  • Ibrahim, Tarek A.
  • Agrawal, Ankur
  • Gaan, Sandeep
  • Mahajan, Ravindranath V.
  • Aleksov, Aleksandar

Abstract

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a first layer, where the first layer comprises glass. In an embodiment, a second layer is over the first layer, where the second layer comprises a mold material. In an embodiment, a first photonics integrated circuit (PIC) is within the second layer. In an embodiment, a second PIC is within the second layer, and a waveguide is in the first layer. In an embodiment, the waveguide optically couples the first PIC to the second PIC.

IPC Classes  ?

  • G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
  • H04B 10/70 - Photonic quantum communication
  • G02B 6/124 - Geodesic lenses or integrated gratings
  • G02B 6/13 - Integrated optical circuits characterised by the manufacturing method