PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

Register USPTO Patent
Application Number 17482234
Status Pending
Filing Date 2021-09-22
First Publication Date 2023-03-23
Publication Date 2023-03-23
Owner Intel Corporation (USA)
Inventor
  • Karhade, Omkar G.
  • Li, Xiaoqian
  • Deshpande, Nitin A.

Abstract

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active side and an opposing backside, and wherein the PIC is embedded in the insulating material with the active side facing down; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer, wherein the second layer includes the insulating material and the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the backside of the PIC and the conductive pillar; and an optical component optically coupled to the active surface of the PIC.

IPC Classes  ?

  • G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
  • G02B 6/42 - Coupling light guides with opto-electronic elements