Register USPTO Patent
Application Number 17482399
Status Pending
Filing Date 2021-09-22
First Publication Date 2023-03-23
Publication Date 2023-03-23
Owner Intel Corporation (USA)
  • Duong, Benjamin
  • Aleksov, Aleksandar
  • Castro De La Torre, Helme A.
  • Darmawikarta, Kristof
  • Grujicic, Darko
  • Kandanur, Sashi S.
  • Nad, Suddhasattwa
  • Pietambaram, Srinivas V.
  • Shanmugam, Rengarajan
  • Sounart, Thomas L.
  • Wall, Marcel


Embodiments described herein may be related to apparatuses, processes, and techniques directed to embedding capacitors in through glass vias within a glass core of a substrate. In embodiments, the through glass vias may extend entirely from a first side of the glass core to a second side of the glass core opposite the first side. Layers of electrically conductive material and dielectric material may then be deposited within the through glass via to form a capacitor. the capacitor may then be electrically coupled with electrical routings on buildup layers on either side of the glass core. Other embodiments may be described and/or claimed.

IPC Classes  ?

  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components
  • H05K 1/03 - Use of materials for the substrate
  • H01G 4/33 - Thin- or thick-film capacitors
  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits