MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES
|First Publication Date||2023-03-23|
|Owner||Intel Corporation (USA)|
AbstractMicroelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a microelectronic subassembly including a first bridge component in a first layer, the first bridge component having a first surface and an opposing second surface, and a die in a second layer, wherein the second layer is on the first layer, and the die is electrically coupled to the second surface of the first bridge component; a package substrate having a second bridge component embedded therein, wherein the second bridge component is electrically coupled to the first surface of the first bridge component; and a microelectronic component on the second surface of the package substrate and electrically coupled to the second bridge component, wherein the microelectronic component is electrically coupled to the die via the first and second bridge components.
IPC Classes ?
- H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups