METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELECTRICS IN CIRCUIT DEVICES
|First Publication Date||2023-03-23|
|Owner||Intel Corporation (USA)|
AbstractMethods and apparatus to improve adhesion between metals and dielectrics in circuit devices are disclosed. An apparatus includes a metal layer, a dielectric layer adjacent the metal layer, and a polymeric bonding layer at an interface between the metal layer and the dielectric layer. A polymer molecule in the polymeric bonding layer including an R1 group, an R2 group, and a polymer chain extending between the R1 group and the R2 group. The R1 group is different than the R2 group. The polymeric bonding layer is bonded to the metal layer via the R1 group. The polymeric bonding layer is bonded to the dielectric layer via the R2 group.