DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS
| Register | USPTO Patent |
|---|---|
| Application Number | 17507010 |
| Status | Pending |
| Filing Date | 2021-09-17 |
| First Publication Date | 2023-03-23 |
| Publication Date | 2023-03-23 |
| Owner | Intel Corporation (USA) |
| Inventor |
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Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques directed to a glass core within a substrate in a package, with one or more through glass vias (TGV) that are filled with a conductive material to electrically couple a first side of the glass core with a second side of the glass layer opposite the first side. A pad, also of conductive material, is electrically and physically coupled with a first and/or second end of the conductive material of the TGV. A layer of dielectric material is between at least a portion of the pad and the surface of the glass core between the pad and the glass core during manufacturing, handling, and/or operation to facilitate a reduction of stress cracks in the glass core. Other embodiments may be described and/or claimed.IPC Classes ?
- H01L 23/15 - Ceramic or glass substrates
- H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device