DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS
|First Publication Date||2023-03-23|
|Owner||Intel Corporation (USA)|
AbstractEmbodiments described herein may be related to apparatuses, processes, and techniques directed to a glass core within a substrate in a package, with one or more through glass vias (TGV) that are filled with a conductive material to electrically couple a first side of the glass core with a second side of the glass layer opposite the first side. A pad, also of conductive material, is electrically and physically coupled with a first and/or second end of the conductive material of the TGV. A layer of dielectric material is between at least a portion of the pad and the surface of the glass core between the pad and the glass core during manufacturing, handling, and/or operation to facilitate a reduction of stress cracks in the glass core. Other embodiments may be described and/or claimed.
IPC Classes ?
- H01L 23/15 - Ceramic or glass substrates
- H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device