LOW-PROFILE FASTENERS WITH SPRINGS FOR HEAT TRANSFER DEVICE LOADING
| Register | USPTO Patent |
|---|---|
| Application Number | 18059534 |
| Status | Pending |
| Filing Date | 2022-11-29 |
| First Publication Date | 2023-03-23 |
| Publication Date | 2023-03-23 |
| Owner | Intel Corporation (USA) |
| Inventor |
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Abstract
Low-profile fasteners with springs that are either integrated with the fastener or are a physically separate component can provide a more evenly distributed load to a heat transfer device, such as a vapor chamber or a heat pipe. The low-profile fasteners do not increase the height of the base of a mobile computing device as the spring and the portion of the fastener that extends past the spring fit within a recess or cavity of the heat transfer device. The spring can be a diaphragm spring, a wave spring, or another suitable spring. The use of low-profile fasteners with springs to fasten a heat transfer device to a mainboard may allow for designs with a smaller mainboard area, which can leave room for a larger thermal management solution (which can increase cooling capacity) and allow for a greater thermal design power for the system.IPC Classes ?
- F16B 23/00 - Specially-shaped heads of bolts or screws for rotations by a tool
- H05K 1/02 - Printed circuits - Details