|
C25F 1/00
|
Electrolytic cleaning, degreasing, pickling, or descaling |
|
C25F 1/02
|
Pickling; Descaling |
|
C25F 1/04
|
Pickling; Descaling in solution |
|
C25F 1/06
|
Pickling; Descaling in solution of iron or steel |
|
C25F 1/08
|
Pickling; Descaling in solution of refractory metals |
|
C25F 1/10
|
Pickling; Descaling in solution of actinides |
|
C25F 1/12
|
Pickling; Descaling in melts |
|
C25F 1/14
|
Pickling; Descaling in melts of iron or steel |
|
C25F 1/16
|
Pickling; Descaling in melts of refractory metals |
|
C25F 1/18
|
Pickling; Descaling in melts of actinides |
|
C25F 3/00
|
Electrolytic etching or polishing |
|
C25F 3/02
|
Etching |
|
C25F 3/04
|
Etching of light metals |
|
C25F 3/06
|
Etching of iron or steel |
|
C25F 3/08
|
Etching of refractory metals |
|
C25F 3/10
|
Etching of actinides |
|
C25F 3/12
|
Etching of semiconducting materials |
|
C25F 3/14
|
Etching locally |
|
C25F 3/16
|
Polishing |
|
C25F 3/18
|
Polishing of light metals |
|
C25F 3/20
|
Polishing of light metals of aluminium |
|
C25F 3/22
|
Polishing of heavy metals |
|
C25F 3/24
|
Polishing of heavy metals of iron or steel |
|
C25F 3/26
|
Polishing of heavy metals of refractory metals |
|
C25F 3/28
|
Polishing of heavy metals of actinides |
|
C25F 3/30
|
Polishing of semiconducting materials |
|
C25F 5/00
|
Electrolytic stripping of metallic layers or coatings |
|
C25F 7/00
|
Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating |
|
C25F 7/02
|
Regeneration of process liquids |
