- All sections
- C - Chemistry; metallurgy
- C23C - Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 18/40 - Coating with copper using reducing agents
Patent holdings for IPC class C23C 18/40
Total number of patents in this class: 255
10-year publication summary
41
|
38
|
16
|
25
|
17
|
14
|
24
|
16
|
7
|
0
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Atotech Deutschland GmbH | 566 |
27 |
BYD Company Limited | 4310 |
12 |
DuPont Electronic Materials International, LLC | 365 |
11 |
MacDermid Enthone Inc. | 234 |
9 |
LG Chem, Ltd. | 17637 |
8 |
Eastman Kodak Company | 3036 |
7 |
Okuno Chemical Industries Co., Ltd. | 99 |
6 |
Tokyo Electron Limited | 12111 |
5 |
Lam Research Corporation | 4995 |
5 |
C. Uyemura & Co., Ltd. | 163 |
5 |
Asahi Kasei Kabushiki Kaisha | 2566 |
4 |
Solvay Specialty Polymers Italy S.p.A. | 737 |
4 |
Ajou University Industry-academic Cooperation Foundation | 971 |
3 |
Fundacion Cidetec | 61 |
3 |
Ishihara Chemical Co., Ltd. | 64 |
3 |
National Research Council of Canada | 1566 |
3 |
Toyo Kohan Co., Ltd. | 412 |
3 |
Atotech Deutschland GmbH & Co. KG | 367 |
3 |
Jiangyin NanoPore Innovative Materials Technology Ltd | 61 |
3 |
FUJIFILM Corporation | 28555 |
2 |
Other owners | 129 |