- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
Patent holdings for IPC class H01L 21/48
Total number of patents in this class: 10774
10-year publication summary
503
|
705
|
1048
|
1299
|
1322
|
1280
|
1388
|
1212
|
1259
|
473
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
1468 |
Intel Corporation | 46080 |
704 |
Samsung Electronics Co., Ltd. | 123537 |
386 |
Advanced Semiconductor Engineering, Inc. | 1536 |
358 |
Texas Instruments Incorporated | 19222 |
338 |
Infineon Technologies AG | 8656 |
264 |
International Business Machines Corporation | 63228 |
252 |
STATS ChipPAC Pte. Lte. | 1479 |
217 |
Micron Technology, Inc. | 24264 |
171 |
Shinko Electric Industries Co., Ltd. | 1194 |
165 |
Semiconductor Components Industries, L.L.C. | 5329 |
153 |
Qualcomm Incorporated | 70412 |
152 |
Invensas Corporation | 680 |
149 |
Mitsubishi Electric Corporation | 41731 |
125 |
NXP USA, Inc. | 4101 |
125 |
Siliconware Precision Industries Co., Ltd. | 457 |
122 |
Renesas Electronics Corporation | 6546 |
113 |
Amkor Technology Singapore Holding Pte. Ltd | 259 |
112 |
Fuji Electric Co., Ltd. | 4507 |
108 |
Amkor Technology Singapore Holding Pte.ltd. | 587 |
87 |
Other owners | 5205 |