- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups
Patent holdings for IPC class H01L 21/50
Total number of patents in this class: 2131
10-year publication summary
251
|
164
|
136
|
101
|
106
|
107
|
122
|
128
|
118
|
37
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
135 |
STATS ChipPAC Pte. Lte. | 1479 |
97 |
Texas Instruments Incorporated | 19222 |
85 |
Intel Corporation | 46080 |
77 |
Micron Technology, Inc. | 24264 |
68 |
Infineon Technologies AG | 8656 |
68 |
Samsung Electronics Co., Ltd. | 123537 |
51 |
Advanced Semiconductor Engineering, Inc. | 1536 |
47 |
International Business Machines Corporation | 63228 |
35 |
Renesas Electronics Corporation | 6546 |
33 |
Semiconductor Components Industries, L.L.C. | 5329 |
28 |
Mitsubishi Electric Corporation | 41731 |
22 |
Shenzhen Xinguodu Technology Co., Ltd. | 2670 |
20 |
Jcet Semiconductor (shaoxing) Co., Ltd. | 366 |
20 |
Shinko Electric Industries Co., Ltd. | 1194 |
19 |
Texas Instruments Japan, Ltd. | 1659 |
18 |
Kioxia Corporation | 9262 |
18 |
Siliconware Precision Industries Co., Ltd. | 457 |
17 |
NXP USA, Inc. | 4101 |
16 |
Amkor Technology Singapore Holding Pte.ltd. | 587 |
16 |
Other owners | 1241 |