- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 21/56
Total number of patents in this class: 12666
10-year publication summary
|
884
|
1147
|
1288
|
1429
|
1441
|
1443
|
1567
|
1382
|
1200
|
454
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
2455 |
| Samsung Electronics Co., Ltd. | 123537 |
510 |
| Intel Corporation | 46080 |
454 |
| Infineon Technologies AG | 8656 |
405 |
| STATS ChipPAC Pte. Lte. | 1479 |
355 |
| Texas Instruments Incorporated | 19222 |
333 |
| Advanced Semiconductor Engineering, Inc. | 1536 |
332 |
| Micron Technology, Inc. | 24264 |
249 |
| Semiconductor Components Industries, L.L.C. | 5329 |
175 |
| Siliconware Precision Industries Co., Ltd. | 457 |
175 |
| NXP USA, Inc. | 4101 |
162 |
| Renesas Electronics Corporation | 6546 |
157 |
| Amkor Technology Singapore Holding Pte. Ltd | 259 |
150 |
| Mitsubishi Electric Corporation | 41731 |
149 |
| Qualcomm Incorporated | 70412 |
128 |
| Rohm Co., Ltd. | 5196 |
127 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 366 |
126 |
| Amkor Technology Singapore Holding Pte.ltd. | 587 |
119 |
| Invensas Corporation | 680 |
118 |
| International Business Machines Corporation | 63228 |
108 |
| Other owners | 5879 |