- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/74 - Making of buried regions of high impurity concentration, e.g. buried collector layers, internal connections
Patent holdings for IPC class H01L 21/74
Total number of patents in this class: 581
10-year publication summary
|
41
|
46
|
50
|
39
|
74
|
67
|
54
|
73
|
71
|
27
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
67 |
| Monolithic 3D Inc. | 240 |
55 |
| Micron Technology, Inc. | 24264 |
28 |
| International Business Machines Corporation | 63228 |
24 |
| Texas Instruments Incorporated | 19222 |
21 |
| Infineon Technologies AG | 8656 |
21 |
| GLOBALFOUNDRIES U.S. Inc. | 6562 |
19 |
| Renesas Electronics Corporation | 6546 |
18 |
| Samsung Electronics Co., Ltd. | 123537 |
15 |
| Elpis Technologies Inc. | 359 |
12 |
| Semiconductor Components Industries, L.L.C. | 5329 |
11 |
| Qualcomm Incorporated | 70412 |
10 |
| Vanguard International Semiconductor Corporation | 393 |
10 |
| Infineon Technologies Austria AG | 1854 |
7 |
| SK Hynix Inc. | 10357 |
7 |
| Kioxia Corporation | 9262 |
7 |
| Tokyo Electron Limited | 11108 |
6 |
| STMicroelectronics (Rousset) SAS | 895 |
6 |
| Intel Corporation | 46080 |
5 |
| STMicroelectronics S.r.l. | 3600 |
5 |
| Other owners | 227 |