- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
Patent holdings for IPC class H01L 21/768
Total number of patents in this class: 22561
10-year publication summary
|
1514
|
2140
|
2219
|
2370
|
2536
|
2611
|
2715
|
2346
|
2249
|
892
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
4686 |
| International Business Machines Corporation | 63228 |
1255 |
| Samsung Electronics Co., Ltd. | 123537 |
1127 |
| Intel Corporation | 46080 |
886 |
| Applied Materials, Inc. | 15552 |
783 |
| Micron Technology, Inc. | 24264 |
768 |
| GLOBALFOUNDRIES U.S. Inc. | 6562 |
649 |
| Tokyo Electron Limited | 11108 |
607 |
| United Microelectronics Corp. | 3679 |
383 |
| SK Hynix Inc. | 10357 |
363 |
| Kioxia Corporation | 9262 |
349 |
| Sandisk Technologies LLC | 5745 |
325 |
| Changxin Memory Technologies, Inc. | 3299 |
291 |
| Lam Research Corporation | 4443 |
280 |
| Sony Semiconductor Solutions Corporation | 7515 |
269 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1739 |
264 |
| Nanya Technology Corporation | 1576 |
251 |
| Infineon Technologies AG | 8656 |
219 |
| Qualcomm Incorporated | 70412 |
212 |
| Yangtze Memory Technologies Co., Ltd. | 1708 |
201 |
| Other owners | 8393 |