- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 5122
10-year publication summary
352
|
512
|
622
|
687
|
603
|
561
|
582
|
551
|
404
|
168
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
580 |
Disco Corporation | 1620 |
451 |
Infineon Technologies AG | 8656 |
220 |
Semiconductor Components Industries, L.L.C. | 5329 |
198 |
Samsung Electronics Co., Ltd. | 123537 |
155 |
Applied Materials, Inc. | 15552 |
147 |
Texas Instruments Incorporated | 19222 |
141 |
Micron Technology, Inc. | 24264 |
133 |
Intel Corporation | 46080 |
72 |
Panasonic Intellectual Property Management Co., Ltd. | 26896 |
65 |
Renesas Electronics Corporation | 6546 |
59 |
Kioxia Corporation | 9262 |
48 |
NXP USA, Inc. | 4101 |
47 |
STATS ChipPAC Pte. Lte. | 1479 |
44 |
Plasma-therm, LLC | 87 |
42 |
Hamamatsu Photonics K.K. | 4014 |
40 |
Advanced Semiconductor Engineering, Inc. | 1536 |
38 |
Xintec Inc. | 252 |
38 |
Mitsubishi Electric Corporation | 41731 |
37 |
International Business Machines Corporation | 63228 |
36 |
Other owners | 2531 |