• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology

Patent holdings for IPC class H01L 21/8252

Total number of patents in this class: 461

10-year publication summary

42
43
51
53
61
59
63
35
31
14
2014 2015 2016 2017 2018 2019 2020 2021 2022 2023

Principal owners for this class

Owner
All patents
This class
Intel Corporation
46080
54
Taiwan Semiconductor Manufacturing Company, Ltd.
33201
42
International Business Machines Corporation
63228
19
Skyworks Solutions, Inc.
3140
17
Murata Manufacturing Co., Ltd.
20675
14
Texas Instruments Incorporated
19222
12
QROMIS, Inc.
85
10
Samsung Electronics Co., Ltd.
123537
9
Qorvo US, Inc.
1885
9
Qualcomm Incorporated
70412
8
Raytheon Company
8496
8
Cambridge GaN Devices Limited
26
8
Innoscience (Suzhou) Technology Co., ltd.
125
8
Efficient Power Conversion Corporation
105
7
Mitsubishi Electric Corporation
41731
6
Cree, Inc.
1294
6
GLOBALFOUNDRIES U.S. Inc.
6562
6
Fujitsu Limited
19903
5
Infineon Technologies Austria AG
1854
5
Semiconductor Components Industries, L.L.C.
5329
5
Other owners 203