- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
Patent holdings for IPC class H01L 21/8252
Total number of patents in this class: 461
10-year publication summary
42
|
43
|
51
|
53
|
61
|
59
|
63
|
35
|
31
|
14
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Intel Corporation | 46080 |
54 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
42 |
International Business Machines Corporation | 63228 |
19 |
Skyworks Solutions, Inc. | 3140 |
17 |
Murata Manufacturing Co., Ltd. | 20675 |
14 |
Texas Instruments Incorporated | 19222 |
12 |
QROMIS, Inc. | 85 |
10 |
Samsung Electronics Co., Ltd. | 123537 |
9 |
Qorvo US, Inc. | 1885 |
9 |
Qualcomm Incorporated | 70412 |
8 |
Raytheon Company | 8496 |
8 |
Cambridge GaN Devices Limited | 26 |
8 |
Innoscience (Suzhou) Technology Co., ltd. | 125 |
8 |
Efficient Power Conversion Corporation | 105 |
7 |
Mitsubishi Electric Corporation | 41731 |
6 |
Cree, Inc. | 1294 |
6 |
GLOBALFOUNDRIES U.S. Inc. | 6562 |
6 |
Fujitsu Limited | 19903 |
5 |
Infineon Technologies Austria AG | 1854 |
5 |
Semiconductor Components Industries, L.L.C. | 5329 |
5 |
Other owners | 203 |