• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/84 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body

Patent holdings for IPC class H01L 21/84

Total number of patents in this class: 4191

10-year publication summary

324
491
528
488
493
416
312
202
133
71
2014 2015 2016 2017 2018 2019 2020 2021 2022 2023

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
33201
516
International Business Machines Corporation
63228
464
GLOBALFOUNDRIES U.S. Inc.
6562
337
Samsung Electronics Co., Ltd.
123537
187
Semiconductor Energy Laboratory Co., Ltd.
11019
166
Boe Technology Group Co., Ltd.
33100
124
Intel Corporation
46080
109
Samsung Display Co., Ltd.
28039
93
Qualcomm Incorporated
70412
84
Commissariat à l'énergie atomique et aux energies alternatives
10542
75
Au Optronics Corporation
4080
69
Renesas Electronics Corporation
6546
66
Monolithic 3D Inc.
240
63
Micron Technology, Inc.
24264
61
Semiconductor Manufacturing International (Shanghai) Corporation
1739
61
United Microelectronics Corp.
3679
58
LG Display Co., Ltd.
11300
54
Elpis Technologies Inc.
359
52
STMicroelectronics, Inc.
946
49
Institute of Microelectronics, Chinese Academy of Sciences
1205
45
Other owners 1458