- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
Patent holdings for IPC class H01L 23/14
Total number of patents in this class: 1786
10-year publication summary
|
147
|
148
|
148
|
143
|
191
|
182
|
186
|
174
|
154
|
53
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
174 |
| Intel Corporation | 46080 |
83 |
| Samsung Electronics Co., Ltd. | 123537 |
53 |
| Murata Manufacturing Co., Ltd. | 20675 |
40 |
| Invensas Corporation | 680 |
35 |
| Mitsubishi Materials Corporation | 2454 |
31 |
| Infineon Technologies AG | 8656 |
30 |
| Rohm Co., Ltd. | 5196 |
29 |
| Mitsubishi Electric Corporation | 41731 |
26 |
| Shinko Electric Industries Co., Ltd. | 1194 |
26 |
| Semiconductor Components Industries, L.L.C. | 5329 |
24 |
| Texas Instruments Incorporated | 19222 |
23 |
| Kyocera Corporation | 12140 |
23 |
| International Business Machines Corporation | 63228 |
22 |
| Fuji Electric Co., Ltd. | 4507 |
22 |
| Applied Materials, Inc. | 15552 |
21 |
| Siliconware Precision Industries Co., Ltd. | 457 |
21 |
| Sumitomo Bakelite Co., Ltd. | 1397 |
20 |
| Qualcomm Incorporated | 70412 |
19 |
| Advanced Semiconductor Engineering, Inc. | 1536 |
19 |
| Other owners | 1045 |