- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/15 - Ceramic or glass substrates
Patent holdings for IPC class H01L 23/15
Total number of patents in this class: 1093
10-year publication summary
|
49
|
71
|
78
|
100
|
112
|
125
|
149
|
103
|
125
|
50
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 46078 |
69 |
| Corning Incorporated | 9775 |
62 |
| Kyocera Corporation | 12134 |
39 |
| Murata Manufacturing Co., Ltd. | 20654 |
31 |
| Toshiba Materials Co., Ltd. | 566 |
28 |
| Agc, Inc. | 3590 |
28 |
| Amosense Co., Ltd. | 370 |
25 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33184 |
23 |
| Toshiba Corporation | 11964 |
22 |
| Toppan Printing Co., Ltd. | 2309 |
22 |
| Semiconductor Components Industries, L.L.C. | 5336 |
21 |
| Mitsubishi Materials Corporation | 2452 |
21 |
| Qualcomm Incorporated | 70338 |
19 |
| NGK Insulators, Ltd. | 4432 |
18 |
| Infineon Technologies AG | 8656 |
17 |
| Shinko Electric Industries Co., Ltd. | 1193 |
16 |
| Asahi Glass Company, Limited | 3087 |
15 |
| Denka Company Limited | 1853 |
14 |
| International Business Machines Corporation | 63166 |
12 |
| Dai Nippon Printing Co., Ltd. | 3835 |
12 |
| Other owners | 579 |