- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
Patent holdings for IPC class H01L 23/29
Total number of patents in this class: 5077
10-year publication summary
|
399
|
463
|
500
|
535
|
512
|
530
|
510
|
369
|
376
|
162
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
301 |
| Mitsubishi Electric Corporation | 41731 |
176 |
| Hitachi Chemical Company, Ltd. | 2607 |
139 |
| Infineon Technologies AG | 8656 |
122 |
| Lintec Corporation | 1857 |
121 |
| Sumitomo Bakelite Co., Ltd. | 1397 |
120 |
| Murata Manufacturing Co., Ltd. | 20675 |
117 |
| Rohm Co., Ltd. | 5196 |
115 |
| Nitto Denko Corporation | 7705 |
105 |
| Samsung Electronics Co., Ltd. | 123537 |
100 |
| DIC Corporation | 3364 |
99 |
| LG Chem, Ltd. | 16607 |
97 |
| Shin-Etsu Chemical Co., Ltd. | 4913 |
92 |
| Intel Corporation | 46080 |
81 |
| Denso Corporation | 23155 |
74 |
| Dow Corning Toray Co., Ltd. | 585 |
71 |
| Namics Corporation | 364 |
66 |
| Panasonic Intellectual Property Management Co., Ltd. | 26896 |
65 |
| Fuji Electric Co., Ltd. | 4507 |
53 |
| Daicel Corporation | 1956 |
52 |
| Other owners | 2911 |