- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
Patent holdings for IPC class H01L 23/31
Total number of patents in this class: 17394
10-year publication summary
|
1095
|
1503
|
1739
|
1856
|
1961
|
2049
|
2201
|
1847
|
1770
|
729
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
2838 |
| Samsung Electronics Co., Ltd. | 123537 |
1083 |
| Intel Corporation | 46080 |
541 |
| Infineon Technologies AG | 8656 |
521 |
| Advanced Semiconductor Engineering, Inc. | 1536 |
418 |
| Texas Instruments Incorporated | 19222 |
414 |
| Rohm Co., Ltd. | 5196 |
402 |
| Mitsubishi Electric Corporation | 41731 |
351 |
| Micron Technology, Inc. | 24264 |
331 |
| STATS ChipPAC Pte. Lte. | 1479 |
321 |
| Renesas Electronics Corporation | 6546 |
248 |
| Semiconductor Components Industries, L.L.C. | 5329 |
207 |
| Siliconware Precision Industries Co., Ltd. | 457 |
200 |
| Murata Manufacturing Co., Ltd. | 20675 |
194 |
| NXP USA, Inc. | 4101 |
174 |
| Denso Corporation | 23155 |
168 |
| Amkor Technology Singapore Holding Pte. Ltd | 259 |
165 |
| Amkor Technology Singapore Holding Pte.ltd. | 587 |
143 |
| Mediatek Inc. | 4276 |
142 |
| Fuji Electric Co., Ltd. | 4507 |
140 |
| Other owners | 8393 |