- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/367 - Cooling facilitated by shape of device
Patent holdings for IPC class H01L 23/367
Total number of patents in this class: 4975
10-year publication summary
|
235
|
381
|
477
|
507
|
605
|
665
|
659
|
641
|
580
|
229
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
373 |
| Intel Corporation | 46080 |
335 |
| Samsung Electronics Co., Ltd. | 123537 |
207 |
| International Business Machines Corporation | 63228 |
188 |
| Mitsubishi Electric Corporation | 41731 |
160 |
| Micron Technology, Inc. | 24264 |
110 |
| Infineon Technologies AG | 8656 |
100 |
| Denso Corporation | 23155 |
88 |
| Fuji Electric Co., Ltd. | 4507 |
82 |
| Huawei Technologies Co., Ltd. | 91895 |
77 |
| Qualcomm Incorporated | 70412 |
60 |
| NXP USA, Inc. | 4101 |
56 |
| Monolithic 3D Inc. | 240 |
53 |
| Semiconductor Components Industries, L.L.C. | 5329 |
46 |
| Advanced Semiconductor Engineering, Inc. | 1536 |
45 |
| Invensas Corporation | 680 |
44 |
| Siemens AG | 26167 |
43 |
| Texas Instruments Incorporated | 19222 |
42 |
| Murata Manufacturing Co., Ltd. | 20675 |
41 |
| Rohm Co., Ltd. | 5196 |
41 |
| Other owners | 2784 |