- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
Patent holdings for IPC class H01L 23/473
Total number of patents in this class: 2611
10-year publication summary
|
207
|
207
|
279
|
244
|
257
|
243
|
289
|
213
|
208
|
76
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| International Business Machines Corporation | 63166 |
114 |
| Fuji Electric Co., Ltd. | 4503 |
106 |
| Mitsubishi Electric Corporation | 41690 |
97 |
| Denso Corporation | 23152 |
94 |
| Intel Corporation | 46078 |
91 |
| Toyota Motor Corporation | 28316 |
55 |
| Hitachi Astemo, Ltd. | 5089 |
49 |
| Fujitsu Limited | 19922 |
41 |
| TOYOTA JIDOSHA KABUSHIKI KAISHA (also trading as TOYOTA MOTOR CORPORATION) | 13427 |
37 |
| Siemens AG | 26186 |
36 |
| Mitsubishi Materials Corporation | 2452 |
36 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33184 |
33 |
| Raytheon Company | 8498 |
26 |
| Infineon Technologies AG | 8656 |
24 |
| Hewlett Packard Enterprise Development LP | 10901 |
22 |
| Kyocera Corporation | 12134 |
21 |
| Cooler Master Co., Ltd. | 169 |
21 |
| Nippon Light Metal Company, Ltd. | 637 |
21 |
| ABB Schweiz AG | 6070 |
18 |
| Hitachi Energy Switzerland AG | 2016 |
18 |
| Other owners | 1651 |