- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Patent holdings for IPC class H01L 23/48
Total number of patents in this class: 14992
10-year publication summary
|
1463
|
1315
|
1180
|
1074
|
990
|
956
|
980
|
841
|
777
|
351
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
1951 |
| Samsung Electronics Co., Ltd. | 123537 |
933 |
| Intel Corporation | 46080 |
756 |
| Micron Technology, Inc. | 24264 |
503 |
| Renesas Electronics Corporation | 6546 |
320 |
| Infineon Technologies AG | 8656 |
311 |
| International Business Machines Corporation | 63228 |
291 |
| STATS ChipPAC Pte. Lte. | 1479 |
281 |
| Texas Instruments Incorporated | 19222 |
248 |
| Mitsubishi Electric Corporation | 41731 |
241 |
| GLOBALFOUNDRIES U.S. Inc. | 6562 |
225 |
| SK Hynix Inc. | 10357 |
206 |
| Kioxia Corporation | 9262 |
199 |
| Qualcomm Incorporated | 70412 |
198 |
| Advanced Semiconductor Engineering, Inc. | 1536 |
198 |
| Rohm Co., Ltd. | 5196 |
183 |
| Invensas Corporation | 680 |
154 |
| Sony Corporation | 35923 |
144 |
| Tessera, Inc. | 690 |
136 |
| Semiconductor Components Industries, L.L.C. | 5329 |
131 |
| Other owners | 7383 |