- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/498 - Leads on insulating substrates
Patent holdings for IPC class H01L 23/498
Total number of patents in this class: 15055
10-year publication summary
1144
|
1257
|
1503
|
1539
|
1601
|
1660
|
1629
|
1491
|
1512
|
1521
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 34962 |
1988 |
Intel Corporation | 45765 |
1193 |
Samsung Electronics Co., Ltd. | 127295 |
1015 |
Advanced Semiconductor Engineering, Inc. | 1541 |
380 |
Qualcomm Incorporated | 73312 |
324 |
Infineon Technologies AG | 8378 |
264 |
Micron Technology, Inc. | 24334 |
259 |
STATS ChipPAC Pte. Lte. | 1478 |
256 |
International Business Machines Corporation | 61980 |
250 |
Shinko Electric Industries Co., Ltd. | 1182 |
244 |
Invensas Corporation | 663 |
240 |
Texas Instruments Incorporated | 19281 |
197 |
Murata Manufacturing Co., Ltd. | 21569 |
192 |
Fuji Electric Co., Ltd. | 4621 |
185 |
Renesas Electronics Corporation | 6409 |
174 |
Mediatek Inc. | 4396 |
171 |
Mitsubishi Electric Corporation | 43049 |
165 |
Siliconware Precision Industries Co., Ltd. | 477 |
165 |
Amkor Technology Singapore Holding Pte. Ltd | 285 |
141 |
SK Hynix Inc. | 10679 |
132 |
Other owners | 7120 |