- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/528 - Layout of the interconnection structure
Patent holdings for IPC class H01L 23/528
Total number of patents in this class: 9377
10-year publication summary
|
209
|
572
|
1020
|
1449
|
1201
|
1190
|
1270
|
1267
|
1249
|
496
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
1965 |
| Samsung Electronics Co., Ltd. | 123537 |
1014 |
| International Business Machines Corporation | 63228 |
472 |
| Micron Technology, Inc. | 24264 |
464 |
| Intel Corporation | 46080 |
420 |
| Kioxia Corporation | 9262 |
358 |
| SK Hynix Inc. | 10357 |
285 |
| GLOBALFOUNDRIES U.S. Inc. | 6562 |
243 |
| Qualcomm Incorporated | 70412 |
204 |
| Sandisk Technologies LLC | 5745 |
193 |
| Renesas Electronics Corporation | 6546 |
172 |
| United Microelectronics Corp. | 3679 |
138 |
| Yangtze Memory Technologies Co., Ltd. | 1708 |
137 |
| Nanya Technology Corporation | 1576 |
115 |
| Changxin Memory Technologies, Inc. | 3299 |
111 |
| Texas Instruments Incorporated | 19222 |
110 |
| Macronix International Co., Ltd. | 2608 |
95 |
| Infineon Technologies AG | 8656 |
77 |
| Socionext Inc. | 1620 |
64 |
| Tessera LLC | 240 |
55 |
| Other owners | 2685 |