- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
Patent holdings for IPC class H01L 23/532
Total number of patents in this class: 7032
10-year publication summary
|
436
|
659
|
862
|
919
|
937
|
918
|
891
|
731
|
689
|
291
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
1540 |
| International Business Machines Corporation | 63228 |
585 |
| Samsung Electronics Co., Ltd. | 123537 |
457 |
| Intel Corporation | 46080 |
317 |
| Micron Technology, Inc. | 24264 |
227 |
| GLOBALFOUNDRIES U.S. Inc. | 6562 |
211 |
| Kioxia Corporation | 9262 |
157 |
| Applied Materials, Inc. | 15552 |
138 |
| Nanya Technology Corporation | 1576 |
122 |
| Renesas Electronics Corporation | 6546 |
118 |
| United Microelectronics Corp. | 3679 |
115 |
| Tokyo Electron Limited | 11108 |
110 |
| Texas Instruments Incorporated | 19222 |
104 |
| Infineon Technologies AG | 8656 |
97 |
| Sandisk Technologies LLC | 5745 |
96 |
| SK Hynix Inc. | 10357 |
90 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1739 |
80 |
| Qualcomm Incorporated | 70412 |
63 |
| Tessera LLC | 240 |
62 |
| Tessera, Inc. | 690 |
59 |
| Other owners | 2284 |