- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Patent holdings for IPC class H01L 23/538
Total number of patents in this class: 8068
10-year publication summary
|
444
|
606
|
617
|
624
|
817
|
1021
|
1165
|
1067
|
1068
|
378
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
1595 |
| Intel Corporation | 46080 |
824 |
| Samsung Electronics Co., Ltd. | 123537 |
606 |
| Advanced Semiconductor Engineering, Inc. | 1536 |
210 |
| Qualcomm Incorporated | 70412 |
189 |
| Micron Technology, Inc. | 24264 |
172 |
| STATS ChipPAC Pte. Lte. | 1479 |
156 |
| Infineon Technologies AG | 8656 |
121 |
| International Business Machines Corporation | 63228 |
110 |
| Samsung Electro-mechanics Co., Ltd. | 4499 |
97 |
| Invensas Corporation | 680 |
96 |
| Mediatek Inc. | 4276 |
91 |
| Murata Manufacturing Co., Ltd. | 20675 |
90 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 366 |
89 |
| SK Hynix Inc. | 10357 |
80 |
| Apple Inc. | 46297 |
79 |
| Amkor Technology Singapore Holding Pte. Ltd | 259 |
77 |
| Shinko Electric Industries Co., Ltd. | 1194 |
67 |
| Tahoe Research, Ltd. | 2316 |
67 |
| Siliconware Precision Industries Co., Ltd. | 457 |
63 |
| Other owners | 3189 |