- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
Patent holdings for IPC class H01L 23/544
Total number of patents in this class: 3223
10-year publication summary
|
182
|
271
|
298
|
360
|
344
|
356
|
339
|
317
|
252
|
123
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
405 |
| Samsung Electronics Co., Ltd. | 123537 |
153 |
| Disco Corporation | 1620 |
92 |
| Renesas Electronics Corporation | 6546 |
90 |
| Micron Technology, Inc. | 24264 |
73 |
| Infineon Technologies AG | 8656 |
69 |
| International Business Machines Corporation | 63228 |
66 |
| Boe Technology Group Co., Ltd. | 33100 |
66 |
| Semiconductor Components Industries, L.L.C. | 5329 |
62 |
| Kioxia Corporation | 9262 |
61 |
| Texas Instruments Incorporated | 19222 |
57 |
| United Microelectronics Corp. | 3679 |
56 |
| Changxin Memory Technologies, Inc. | 3299 |
53 |
| Samsung Display Co., Ltd. | 28039 |
49 |
| Intel Corporation | 46080 |
48 |
| Monolithic 3D Inc. | 240 |
35 |
| ASML Netherlands B.V. | 6535 |
33 |
| SK Hynix Inc. | 10357 |
29 |
| Mitsubishi Electric Corporation | 41731 |
27 |
| Applied Materials, Inc. | 15552 |
24 |
| Other owners | 1675 |