- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patent holdings for IPC class H01L 25/00
Total number of patents in this class: 8103
10-year publication summary
|
425
|
743
|
856
|
907
|
926
|
873
|
940
|
847
|
878
|
344
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
1755 |
| Intel Corporation | 46080 |
475 |
| Samsung Electronics Co., Ltd. | 123537 |
404 |
| Micron Technology, Inc. | 24264 |
395 |
| Murata Manufacturing Co., Ltd. | 20675 |
164 |
| International Business Machines Corporation | 63228 |
146 |
| Kioxia Corporation | 9262 |
136 |
| Invensas Corporation | 680 |
117 |
| Yangtze Memory Technologies Co., Ltd. | 1708 |
108 |
| Qualcomm Incorporated | 70412 |
97 |
| Xilinx, Inc. | 4126 |
91 |
| STATS ChipPAC Pte. Lte. | 1479 |
90 |
| Infineon Technologies AG | 8656 |
88 |
| Advanced Semiconductor Engineering, Inc. | 1536 |
85 |
| SK Hynix Inc. | 10357 |
82 |
| Sandisk Technologies LLC | 5745 |
78 |
| Texas Instruments Incorporated | 19222 |
77 |
| Nanya Technology Corporation | 1576 |
69 |
| Semiconductor Components Industries, L.L.C. | 5329 |
67 |
| Monolithic 3D Inc. | 240 |
64 |
| Other owners | 3515 |