• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Patent holdings for IPC class H01L 25/065

Total number of patents in this class: 14064

10-year publication summary

998
1148
1249
1315
1416
1452
1544
1630
1803
359
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
36182
2321
Samsung Electronics Co., Ltd.
129629
1402
Intel Corporation
45384
1161
Micron Technology, Inc.
24666
806
SK Hynix Inc.
10894
355
Kioxia Corporation
9703
299
Qualcomm Incorporated
75163
243
International Business Machines Corporation
61439
242
Invensas Corporation
651
238
Sandisk Technologies LLC
5683
173
Advanced Semiconductor Engineering, Inc.
1539
168
Murata Manufacturing Co., Ltd.
21978
145
STATS ChipPAC Pte. Lte.
1503
141
Yangtze Memory Technologies Co., Ltd.
1889
127
Infineon Technologies AG
8281
124
Xilinx, Inc.
4112
121
Renesas Electronics Corporation
6346
115
Nanya Technology Corporation
1959
112
Mediatek Inc.
4509
111
Sony Semiconductor Solutions Corporation
8568
107
Other owners 5553