• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Patent holdings for IPC class H01L 25/065

Total number of patents in this class: 12733

10-year publication summary

732
998
1148
1249
1312
1413
1447
1515
1578
735
2014 2015 2016 2017 2018 2019 2020 2021 2022 2023

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
33201
2037
Samsung Electronics Co., Ltd.
123537
1222
Intel Corporation
46080
1068
Micron Technology, Inc.
24264
755
SK Hynix Inc.
10357
327
Kioxia Corporation
9262
259
Invensas Corporation
680
241
International Business Machines Corporation
63228
222
Qualcomm Incorporated
70412
221
Advanced Semiconductor Engineering, Inc.
1536
155
STATS ChipPAC Pte. Lte.
1479
136
Sandisk Technologies LLC
5745
130
Infineon Technologies AG
8656
125
Murata Manufacturing Co., Ltd.
20675
119
Xilinx, Inc.
4126
115
Renesas Electronics Corporation
6546
111
Yangtze Memory Technologies Co., Ltd.
1708
111
Mediatek Inc.
4276
97
Apple Inc.
46297
91
Nanya Technology Corporation
1576
89
Other owners 5102