- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
Patent holdings for IPC class H01L 25/10
Total number of patents in this class: 2956
10-year publication summary
222
|
296
|
312
|
277
|
335
|
314
|
302
|
215
|
256
|
106
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
814 |
Samsung Electronics Co., Ltd. | 123537 |
382 |
Intel Corporation | 46080 |
146 |
STATS ChipPAC Pte. Lte. | 1479 |
109 |
Invensas Corporation | 680 |
101 |
Micron Technology, Inc. | 24264 |
83 |
Qualcomm Incorporated | 70412 |
65 |
Tessera, Inc. | 690 |
57 |
Jcet Semiconductor (shaoxing) Co., Ltd. | 366 |
52 |
Murata Manufacturing Co., Ltd. | 20675 |
41 |
Mediatek Inc. | 4276 |
41 |
Advanced Semiconductor Engineering, Inc. | 1536 |
36 |
Amkor Technology Singapore Holding Pte. Ltd | 259 |
35 |
Apple Inc. | 46297 |
34 |
Shinko Electric Industries Co., Ltd. | 1194 |
33 |
Siliconware Precision Industries Co., Ltd. | 457 |
28 |
Rambus Inc. | 2419 |
24 |
Infineon Technologies AG | 8656 |
23 |
Invensas LLC | 117 |
23 |
Amkor Technology Singapore Holding Pte.ltd. | 587 |
20 |
Other owners | 809 |