- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
Patent holdings for IPC class H01L 25/18
Total number of patents in this class: 6859
10-year publication summary
|
333
|
398
|
430
|
461
|
611
|
734
|
871
|
907
|
982
|
378
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 41690 |
506 |
| Samsung Electronics Co., Ltd. | 123340 |
492 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33184 |
353 |
| Intel Corporation | 46078 |
316 |
| Murata Manufacturing Co., Ltd. | 20654 |
294 |
| Fuji Electric Co., Ltd. | 4503 |
292 |
| Micron Technology, Inc. | 24260 |
284 |
| Rohm Co., Ltd. | 5191 |
226 |
| Denso Corporation | 23152 |
156 |
| Kioxia Corporation | 9260 |
154 |
| Yangtze Memory Technologies Co., Ltd. | 1704 |
107 |
| Samsung Display Co., Ltd. | 27993 |
104 |
| SK Hynix Inc. | 10343 |
97 |
| Hitachi Automotive Systems, Ltd. | 4001 |
86 |
| Sandisk Technologies LLC | 5749 |
85 |
| Sumitomo Electric Industries, Ltd. | 13513 |
83 |
| Shindengen Electric Manufacturing Co., Ltd. | 768 |
82 |
| Hitachi, Ltd. | 16391 |
81 |
| Panasonic Corporation | 21749 |
80 |
| Sony Semiconductor Solutions Corporation | 7486 |
75 |
| Other owners | 2906 |