- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
Patent holdings for IPC class H01L 27/02
Total number of patents in this class: 8036
10-year publication summary
|
590
|
755
|
921
|
985
|
967
|
1010
|
874
|
718
|
607
|
252
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33184 |
1152 |
| Samsung Electronics Co., Ltd. | 123340 |
552 |
| Qualcomm Incorporated | 70338 |
242 |
| Texas Instruments Incorporated | 19204 |
237 |
| Boe Technology Group Co., Ltd. | 32993 |
233 |
| Renesas Electronics Corporation | 6555 |
196 |
| Intel Corporation | 46078 |
189 |
| Micron Technology, Inc. | 24260 |
166 |
| United Microelectronics Corp. | 3677 |
159 |
| GLOBALFOUNDRIES U.S. Inc. | 6570 |
155 |
| Infineon Technologies AG | 8656 |
141 |
| International Business Machines Corporation | 63166 |
123 |
| Socionext Inc. | 1621 |
119 |
| Semiconductor Components Industries, L.L.C. | 5336 |
90 |
| SK Hynix Inc. | 10343 |
89 |
| Rohm Co., Ltd. | 5191 |
88 |
| NXP USA, Inc. | 4096 |
88 |
| Semiconductor Energy Laboratory Co., Ltd. | 11015 |
84 |
| Monolithic 3D Inc. | 237 |
74 |
| Changxin Memory Technologies, Inc. | 3276 |
72 |
| Other owners | 3787 |