• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration

Patent holdings for IPC class H01L 27/06

Total number of patents in this class: 6509

10-year publication summary

512
699
738
696
731
747
702
560
560
198
2014 2015 2016 2017 2018 2019 2020 2021 2022 2023

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
33201
648
Semiconductor Energy Laboratory Co., Ltd.
11019
471
Fuji Electric Co., Ltd.
4507
280
International Business Machines Corporation
63228
204
Texas Instruments Incorporated
19222
189
Intel Corporation
46080
184
Micron Technology, Inc.
24264
183
Samsung Electronics Co., Ltd.
123537
174
Renesas Electronics Corporation
6546
152
GLOBALFOUNDRIES U.S. Inc.
6562
132
Monolithic 3D Inc.
240
129
Qualcomm Incorporated
70412
127
Mitsubishi Electric Corporation
41731
127
Infineon Technologies AG
8656
117
Rohm Co., Ltd.
5196
116
Denso Corporation
23155
100
Infineon Technologies Austria AG
1854
84
Semiconductor Components Industries, L.L.C.
5329
82
Toshiba Corporation
11964
77
Murata Manufacturing Co., Ltd.
20675
68
Other owners 2865