- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
Patent holdings for IPC class H01L 27/06
Total number of patents in this class: 6509
10-year publication summary
512
|
699
|
738
|
696
|
731
|
747
|
702
|
560
|
560
|
198
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
648 |
Semiconductor Energy Laboratory Co., Ltd. | 11019 |
471 |
Fuji Electric Co., Ltd. | 4507 |
280 |
International Business Machines Corporation | 63228 |
204 |
Texas Instruments Incorporated | 19222 |
189 |
Intel Corporation | 46080 |
184 |
Micron Technology, Inc. | 24264 |
183 |
Samsung Electronics Co., Ltd. | 123537 |
174 |
Renesas Electronics Corporation | 6546 |
152 |
GLOBALFOUNDRIES U.S. Inc. | 6562 |
132 |
Monolithic 3D Inc. | 240 |
129 |
Qualcomm Incorporated | 70412 |
127 |
Mitsubishi Electric Corporation | 41731 |
127 |
Infineon Technologies AG | 8656 |
117 |
Rohm Co., Ltd. | 5196 |
116 |
Denso Corporation | 23155 |
100 |
Infineon Technologies Austria AG | 1854 |
84 |
Semiconductor Components Industries, L.L.C. | 5329 |
82 |
Toshiba Corporation | 11964 |
77 |
Murata Manufacturing Co., Ltd. | 20675 |
68 |
Other owners | 2865 |