- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/22 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate using similar magnetic field effects
Patent holdings for IPC class H01L 27/22
Total number of patents in this class: 4292
10-year publication summary
|
251
|
262
|
364
|
399
|
430
|
601
|
680
|
546
|
495
|
185
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33184 |
541 |
| Samsung Electronics Co., Ltd. | 123340 |
445 |
| International Business Machines Corporation | 63166 |
321 |
| Kioxia Corporation | 9260 |
311 |
| SK Hynix Inc. | 10343 |
194 |
| TDK Corporation | 6186 |
176 |
| United Microelectronics Corp. | 3677 |
161 |
| Intel Corporation | 46078 |
131 |
| Integrated Silicon Solutions, (Cayman) Inc. | 218 |
121 |
| Everspin Technologies, Inc. | 465 |
104 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 712 |
100 |
| Qualcomm Incorporated | 70338 |
95 |
| Sony Corporation | 35977 |
94 |
| Micron Technology, Inc. | 24260 |
94 |
| Western Digital Technologies, Inc. | 7108 |
87 |
| Avalanche Technology, Inc. | 297 |
72 |
| Sandisk Technologies LLC | 5749 |
63 |
| Tohoku University | 2338 |
47 |
| Toshiba Corporation | 11964 |
45 |
| Infineon Technologies AG | 8656 |
37 |
| Other owners | 1053 |