- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
Patent holdings for IPC class H01L 29/06
Total number of patents in this class: 24443
10-year publication summary
1472
|
2279
|
2965
|
3082
|
2840
|
2647
|
2299
|
2059
|
2234
|
923
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 33184 |
3725 |
International Business Machines Corporation | 63166 |
1564 |
Samsung Electronics Co., Ltd. | 123340 |
1353 |
GLOBALFOUNDRIES U.S. Inc. | 6570 |
724 |
Fuji Electric Co., Ltd. | 4503 |
708 |
Intel Corporation | 46078 |
698 |
Infineon Technologies AG | 8656 |
519 |
United Microelectronics Corp. | 3677 |
500 |
Mitsubishi Electric Corporation | 41690 |
389 |
Rohm Co., Ltd. | 5191 |
388 |
Infineon Technologies Austria AG | 1852 |
351 |
Texas Instruments Incorporated | 19204 |
350 |
Toshiba Corporation | 11964 |
334 |
Renesas Electronics Corporation | 6555 |
332 |
Denso Corporation | 23152 |
322 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1740 |
312 |
Micron Technology, Inc. | 24260 |
246 |
Semiconductor Components Industries, L.L.C. | 5336 |
234 |
Semiconductor Manufacturing International (Beijing) Corporation | 1001 |
212 |
Sumitomo Electric Industries, Ltd. | 13513 |
176 |
Other owners | 11006 |