- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
Patent holdings for IPC class H01L 29/08
Total number of patents in this class: 10821
10-year publication summary
|
611
|
873
|
1244
|
1346
|
1293
|
1495
|
1365
|
1046
|
695
|
276
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 33201 |
1686 |
| International Business Machines Corporation | 63228 |
725 |
| Samsung Electronics Co., Ltd. | 123537 |
599 |
| Samsung Display Co., Ltd. | 28039 |
512 |
| GLOBALFOUNDRIES U.S. Inc. | 6562 |
387 |
| Intel Corporation | 46080 |
368 |
| Fuji Electric Co., Ltd. | 4507 |
275 |
| Infineon Technologies AG | 8656 |
208 |
| LG Display Co., Ltd. | 11300 |
198 |
| United Microelectronics Corp. | 3679 |
193 |
| Texas Instruments Incorporated | 19222 |
172 |
| Boe Technology Group Co., Ltd. | 33100 |
167 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1739 |
136 |
| Toshiba Corporation | 11964 |
130 |
| Infineon Technologies Austria AG | 1854 |
129 |
| Renesas Electronics Corporation | 6546 |
126 |
| Micron Technology, Inc. | 24264 |
119 |
| Denso Corporation | 23155 |
109 |
| Rohm Co., Ltd. | 5196 |
107 |
| Semiconductor Energy Laboratory Co., Ltd. | 11019 |
103 |
| Other owners | 4372 |