- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 1/03 - Use of materials for the substrate
Patent holdings for IPC class H05K 1/03
Total number of patents in this class: 6912
10-year publication summary
|
538
|
686
|
676
|
685
|
715
|
703
|
682
|
633
|
640
|
236
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 20675 |
261 |
| Panasonic Intellectual Property Management Co., Ltd. | 26896 |
216 |
| Mitsubishi Gas Chemical Company, Inc. | 3078 |
200 |
| DIC Corporation | 3364 |
115 |
| Kyocera Corporation | 12140 |
109 |
| Shengyi Technology Co., Ltd. | 255 |
100 |
| Hitachi Chemical Company, Ltd. | 2607 |
93 |
| Ibiden Co., Ltd. | 1726 |
87 |
| LG Innotek Co., Ltd. | 6108 |
83 |
| International Business Machines Corporation | 63228 |
81 |
| Nitto Denko Corporation | 7705 |
75 |
| Denka Company Limited | 1852 |
73 |
| Agc, Inc. | 3597 |
72 |
| Kaneka Corporation | 4337 |
70 |
| Intel Corporation | 46080 |
66 |
| Resonac Corporation | 898 |
66 |
| Samsung Electro-mechanics Co., Ltd. | 4499 |
63 |
| Apple Inc. | 46297 |
61 |
| Sumitomo Electric Industries, Ltd. | 13520 |
52 |
| Toshiba Materials Co., Ltd. | 566 |
52 |
| Other owners | 4917 |