- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
Patent holdings for IPC class H05K 3/38
Total number of patents in this class: 1353
10-year publication summary
|
93
|
124
|
103
|
124
|
109
|
134
|
110
|
113
|
110
|
36
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| JX Nippon Mining & Metals Corporation | 1636 |
54 |
| Mitsui Mining & Smelting Co., Ltd. | 1308 |
43 |
| Atotech Deutschland GmbH | 682 |
37 |
| Sumitomo Electric Industries, Ltd. | 13513 |
36 |
| Mitsubishi Materials Corporation | 2452 |
31 |
| Kyocera Corporation | 12134 |
28 |
| Sumitomo Electric Printed Circuits, Inc. | 238 |
27 |
| Murata Manufacturing Co., Ltd. | 20654 |
24 |
| DIC Corporation | 3359 |
24 |
| LG Innotek Co., Ltd. | 6088 |
21 |
| Toshiba Materials Co., Ltd. | 566 |
19 |
| Denka Company Limited | 1853 |
17 |
| FUJIFILM Corporation | 25728 |
16 |
| Ibiden Co., Ltd. | 1725 |
16 |
| Shinko Electric Industries Co., Ltd. | 1193 |
16 |
| The Furukawa Electric Co., Ltd. | 3327 |
16 |
| MEC Company Ltd. | 69 |
16 |
| Panasonic Intellectual Property Management Co., Ltd. | 26851 |
15 |
| International Business Machines Corporation | 63166 |
13 |
| Intel Corporation | 46078 |
12 |
| Other owners | 872 |