- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 7/10 - Plug-in assemblages of components
Patent holdings for IPC class H05K 7/10
Total number of patents in this class: 1035
10-year publication summary
|
107
|
100
|
127
|
75
|
71
|
77
|
42
|
40
|
31
|
13
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 46080 |
49 |
| Hewlett Packard Enterprise Development LP | 10892 |
24 |
| Foxconn Interconnect Technology Limited | 994 |
23 |
| Samsung Electronics Co., Ltd. | 123537 |
22 |
| Hon Hai Precision Industry Co., Ltd. | 4358 |
21 |
| Apple Inc. | 46297 |
17 |
| Dell Products L.P. | 8981 |
17 |
| Lotes Co., Ltd. | 353 |
17 |
| Shinko Electric Industries Co., Ltd. | 1194 |
16 |
| TE Connectivity Solutions GmbH | 2449 |
15 |
| International Business Machines Corporation | 63228 |
12 |
| Huawei Technologies Co., Ltd. | 91895 |
12 |
| Murata Manufacturing Co., Ltd. | 20675 |
12 |
| Cisco Technology, Inc. | 18706 |
10 |
| Infineon Technologies AG | 8656 |
10 |
| Samsung Electro-mechanics Co., Ltd. | 4499 |
10 |
| Molex Incorporated | 737 |
10 |
| Samsung Display Co., Ltd. | 28039 |
9 |
| Fujitsu Limited | 19903 |
8 |
| Advanced Micro Devices, Inc. | 5055 |
8 |
| Other owners | 713 |