Nitto Denko Corporation

Japan

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[Owner] Nitto Denko Corporation 7,910
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IPC Class
G02B 5/30 - Polarising elements 1,414
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors 840
C09J 7/38 - Pressure-sensitive adhesives [PSA] 807
C09J 7/02 - on carriers 640
B32B 27/00 - Layered products essentially comprising synthetic resin 606
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17 - Rubber and plastic; packing and insulating materials 146
11 - Environmental control apparatus 94
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16 - Paper, cardboard and goods made from these materials 68
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1.

ADHESIVE SHEET AND METHOD FOR RECYCLING ADHESIVE SHEET

      
Application Number JP2024004130
Publication Number 2024/185378
Status In Force
Filing Date 2024-02-07
Publication Date 2024-09-12
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ito Katsunori
  • Kosaka Naofumi

Abstract

Provided is an adhesive sheet having excellent recyclability. [1] An adhesive sheet according to an embodiment of the present invention comprises an adhesive layer, a separation layer and a substrate. The separation layer is constituted from an alcohol-soluble resin or a water-soluble resin. [2] In the adhesive sheet described in [1], the anchoring strength A of the adhesive sheet may be 1 N/20 mm or more. [3] In the adhesive sheet described in [1] or [2], the ratio of the anchoring strength A of the adhesive sheet relative to the adhesive strength A of the adhesive sheet may be 2 or more.

IPC Classes  ?

  • C09J 7/29 - Laminated material
  • B29B 17/02 - Separating plastics from other materials
  • B32B 7/06 - Interconnection of layers permitting easy separation
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 133/04 - Homopolymers or copolymers of esters

2.

RECOVERY METHOD FOR POLYESTER ADHESIVE RAW MATERIAL, MANUFACTURING METHOD FOR RECYCLED POLYESTER ADHESIVE, MANUFACTURING METHOD FOR RECYCLED POLYESTER BASE MATERIAL, AND MANUFACTURING METHOD FOR RECYCLED POLYESTER ADHESIVE TAPE

      
Application Number JP2024005632
Publication Number 2024/185472
Status In Force
Filing Date 2024-02-16
Publication Date 2024-09-12
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ito Katsunori
  • Shibano Masaya
  • Nakayama Junichi

Abstract

Provided is a method for efficiently recovering polyester adhesive raw material from a polyester adhesive including polyester polymers by using a simple device. Additionally, provided is a recycling system using at least one type of polyester adhesive raw material recovered by such a method, specifically, a manufacturing method for a recycled polyester adhesive, a manufacturing method for a recycled polyester base material, and a manufacturing method for a recycled polyester adhesive tape. A recovery method for a polyester adhesive raw material according to an embodiment of the present invention is a method for recovering a polyester adhesive raw material from a polyester adhesive, and comprises recovering the polyester adhesive raw material by agitating and depolymerizing a mixture including the polyester adhesive and an alkylene glycol under a pressure of 2 atm to 100 atm and at a temperature of 100°C to 500°C, the polyester adhesive being formed from a polyester adhesive composition including polyester polymers (a).

IPC Classes  ?

  • C08J 11/24 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by treatment with organic material by treatment with organic oxygen-containing compounds containing hydroxyl groups

3.

ELECTRODE, AND ELECTROCHEMICAL MEASURING SYSTEM

      
Application Number JP2024002898
Publication Number 2024/180988
Status In Force
Filing Date 2024-01-30
Publication Date 2024-09-06
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Toshima, Ayaka
  • Katagiri, Masayoshi
  • Iguchi, Honami

Abstract

An electrode 1 comprises a substrate 2, a metal base layer 3, and an electrically conductive carbon layer 4 in the stated order toward one side in a thickness direction. The material of the metal base layer 3 is an alloy containing a first metal and a second metal. The first metal has a first potential window and a first activity obtained using a first electrochemical measuring system 10A that includes a first sample electrode 1A comprising the substrate 2, the metal base layer 3 made of the first metal, and the electrically conductive carbon layer 4. The second metal has a second potential window and a second activity obtained using a second electrochemical measuring system 10B. The first metal and the second metal are mutually different. The second activity is equivalent to or greater than the first activity. The first potential window is equivalent to or larger than the second potential window.

IPC Classes  ?

  • G01N 27/30 - Electrodes, e.g. test electrodes; Half-cells
  • B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance

4.

ANTI-ICING SHEET

      
Application Number JP2024006845
Publication Number 2024/181370
Status In Force
Filing Date 2024-02-26
Publication Date 2024-09-06
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kobayashi Soichiro
  • Maruoka Nobuaki

Abstract

The present invention provides an anti-icing sheet that has excellent anti-icing performance even in environments in which temperature is always low, and excellent low-temperature adhesion properties. The present invention pertains to: an anti-icing sheet which comprises a functional layer and an adhesive layer, and in which the functional layer contains a silicone resin and a polyether-modified silicone oil, the contained amount of the polyether-modified silicone oil is at least 30 parts by mass with respect to 100 parts by mass of the silicone resin, and the adhesion strength of the adhesive layer is at least 3.0 N/20 mm at -20°C; and an anti-icing sheet which comprises a functional layer and an adhesive layer, and in which the functional layer contains a silicone resin and a silicone oil, the adhesion strength of the adhesive layer is at least 3.0 N/20 mm at -20°C, and the icing force of the anti-icing sheet after being allowed to stand in a state in which the anti-icing sheet is at an angle of 90° with respect to a horizontal plane in an environment of -20°C for 2 weeks is at most 1.0 N/cm2.

IPC Classes  ?

  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 201/00 - Adhesives based on unspecified macromolecular compounds

5.

WATER-DISPERSION TYPE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number JP2024003748
Publication Number 2024/181047
Status In Force
Filing Date 2024-02-05
Publication Date 2024-09-06
Owner NITTO DENKO CORPORATION (Japan)
Inventor Hirano, Keisuke

Abstract

Provided is a water-dispersion type pressure-sensitive adhesive composition comprising an acrylic polymer. The acrylic polymer includes a (meth) acrylic acid alkyl ester (m1) as the main component thereof, and is a polymer of monomer components that include a carboxyl group-containing monomer (m2) and a nitrogen atom-containing monomer (m3) in which a nitrogen atom is not bonded to a hydrogen atom. The carboxyl group-containing monomer (m2) includes acrylic acid (m2a) and a monomer (m2b) that has a higher hydrophobicity than acrylic acid.

IPC Classes  ?

  • C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

6.

COMPOSITE SEMIPERMEABLE MEMBRANE, AND SPIRAL MEMBRANE ELEMENT

      
Application Number 18440083
Status Pending
Filing Date 2024-02-13
First Publication Date 2024-09-05
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Miyabe, Tomotsugu
  • Hirabara, Atsuki

Abstract

A composite semipermeable membrane includes: a porous support including a porous resin layer; and a separation functional layer formed of a polyamide-based resin on the porous resin layer. The polyamide-based resin contains a resin component derived from a divalent polyfunctional amine and a trivalent or higher polyfunctional acid halide, a molar ratio of the trivalent or higher polyfunctional acid halide to the divalent polyfunctional amine is in a range of 0.65 to 1.00, and a terminal carboxyl group concentration is 0.01 or less. The composite semipermeable membrane has an amide intensity ratio of 0.60 or more, the amide intensity ratio being a ratio of an absorption peak intensity derived from C═O stretching vibration of an amide group to an absorption peak intensity derived from a repeating unit of the porous resin layer, when measuring the absorption peaks by an ATR-IR method.

IPC Classes  ?

7.

WIRING CIRCUIT BOARD

      
Application Number 18444079
Status Pending
Filing Date 2024-02-16
First Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Shibata, Shusaku
  • Kouchi, Takaya
  • Niino, Teppei

Abstract

A wiring circuit board includes a base insulating layer, a conductive layer, and a cover insulating layer. The conductive layer has a terminal and a wiring. The wiring has a body portion and a connecting portion. The connecting portion connects the body portion to the terminal. The cover insulating layer has a cover body portion and a protruding portion. The cover body portion covers the body portion. The protruding portion covers the connecting portion. The protruding portion protrudes from the cover body portion.

IPC Classes  ?

8.

PROTECTIVE COVER MEMBER, SHEET FOR MEMBER SUPPLY, AND MICROELECTROMECHANICAL SYSTEM

      
Application Number 18573110
Status Pending
Filing Date 2022-07-01
First Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tanaka, Eisaku
  • Inoue, Takeo
  • Ishii, Kyoko

Abstract

A provided protective cover member is a member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the protective cover member is placed on the face; and an adhesive layer. When a portion, of the protective membrane, coinciding with the adhesive layer when viewed in a direction perpendicular to a principal surface of the protective membrane is defined as a fixed portion of the protective membrane, an exposed surface of the protective membrane on a side opposite to a side, of the protective membrane, facing the adhesive layer has a region A overlapping the fixed portion when viewed in the perpendicular direction and having a contact angle of 55 degrees or more for methanol.

IPC Classes  ?

  • B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • C09J 11/04 - Non-macromolecular additives inorganic
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters
  • C09J 161/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
  • C09J 163/00 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

9.

OPTICAL LAMINATE FOR OLED DISPLAY DEVICE

      
Application Number JP2024005864
Publication Number 2024/177023
Status In Force
Filing Date 2024-02-19
Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fuchida, Takehito
  • Miyamoto, Kodai

Abstract

Provided is an optical laminate used in an OLED display device which does not use a polarizing plate, the optical laminate being less susceptible to color shift, interference unevenness, and white blurring that occur when viewed from an oblique direction. The present invention provides an optical laminate used in an OLED display device in which only an optical element having a polarization degree of 95% or less is laminated on the viewing side of an OLED element. The optical element comprises at least an antireflective layer and an adhesive layer having a light scattering property. In the reflectance spectrum of the OLED display device, when the maximum value at wavelengths of 380-455 nm is defined as Rp1, the reflectance of the antireflective layer at the wavelength at Rp1 is defined as Rf1, the maximum value at wavelengths of 460-530 nm is defined as Rp2, the reflectance of the antireflective layer at the wavelength at Rp2 is defined as Rf2, and the haze value of the adhesive layer having the light scattering property is defined as H%, the value of H/\{[Rf1/Rp1]+[Rf2/Rp2]\} is 200 or more.

IPC Classes  ?

  • G02B 1/115 - Multilayers
  • B32B 7/023 - Optical properties
  • G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
  • G02B 5/02 - Diffusing elements; Afocal elements
  • H10K 50/854 - Arrangements for extracting light from the devices comprising scattering means
  • H10K 50/86 - Arrangements for improving contrast, e.g. preventing reflection of ambient light
  • H10K 59/10 - OLED displays

10.

OPTICAL LAMINATE FOR OLED DISPLAY DEVICE

      
Application Number JP2024005869
Publication Number 2024/177025
Status In Force
Filing Date 2024-02-19
Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fuchida, Takehito
  • Miyamoto, Kodai

Abstract

The present invention provides an optical laminate to be used in an OLED display device that does not use a polarizing plate and is not susceptible to interference variations or white blurring. Specifically provided is an optical laminate to be used in an OLED display device in which only an optical element having a degree of polarization of 95% or less is layered on the viewing side of an OLED element. The optical element includes at least an anti-reflective layer and an anti-glare layer. When, in the reflectance spectrum of the OLED display device, Rp1 is the maximum value at wavelengths of 380-455 nm, Rf1 is the reflectance of the anti-reflective layer at the wavelength WL1 at Rp1, S1 is the scattering efficiency of the anti-glare layer at the wavelength WL1, Rp2 is the maximum value at wavelengths of 460-530 nm, Rf2 is the reflectance of the anti-reflective layer at the wavelength WL2 at Rp2, and S2 is the scattering efficiency of the anti-glare layer at the wavelength WL2, the value of (S1 + S2)/{[Rf1/Rp1] + [Rf2/Rp2]} is 100 or greater.

IPC Classes  ?

  • G02B 5/02 - Diffusing elements; Afocal elements
  • B32B 7/023 - Optical properties
  • G02B 1/115 - Multilayers
  • G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
  • H10K 50/854 - Arrangements for extracting light from the devices comprising scattering means
  • H10K 50/86 - Arrangements for improving contrast, e.g. preventing reflection of ambient light
  • H10K 59/10 - OLED displays

11.

POLYESTER RESIN COMPOSITION AND POLYESTER RESIN MOLDED ARTICLE

      
Application Number JP2024006108
Publication Number 2024/177079
Status In Force
Filing Date 2024-02-20
Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ishiguro Shigeki
  • Yamada Yosuke
  • Yamamoto Takayuki

Abstract

Provided is a polyester resin composition capable of realizing excellent melt properties and excellent mechanical properties. Also provided is a polyester resin molded article obtained by molding such a polyester resin composition. A polyester resin composition according to an embodiment of the present invention contains a polyester resin (A), a polyolefin resin (B), a glycidyl group-containing resin (C), and a polycarbodiimide (D). The glycidyl group-containing resin (C) includes 2-30 wt% of a glycidyl methacrylate unit in the molecule.

IPC Classes  ?

  • C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
  • C08K 5/29 - Compounds containing carbon-to-nitrogen double bonds
  • C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
  • C08L 51/04 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
  • C08L 63/10 - Epoxy resins modified by unsaturated compounds

12.

PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE

      
Application Number 18566505
Status Pending
Filing Date 2022-05-11
First Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kumada, Tatsuya
  • Ogino, Yoshiko
  • Hara, Yusuke
  • Naito, Tomonari

Abstract

A pressure-sensitive adhesive composition includes a β-1,3-glucan derivative obtained by introducing an acyl group into a β-1,3-glucan, the β-1,3-glucan derivative having a degree of substitution of the acyl group of 2.6 or more and less than 3.0, and a compound having both of a (meth)acryloyl group and a hydroxyl-group-reactive functional group, and/or a reaction product of the β-1,3-glucan derivative and the compound having both of a (meth)acryloyl group and a hydroxyl-group-reactive functional group; and a photo-radical generator.

IPC Classes  ?

  • C09J 105/00 - Adhesives based on polysaccharides or on their derivatives, not provided for in groups or
  • C08B 37/00 - Preparation of polysaccharides not provided for in groups ; Derivatives thereof
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

13.

ADHESIVE SHEET FOR SEMICONDUCTOR ELEMENT FABRICATION

      
Application Number 18572140
Status Pending
Filing Date 2022-02-22
First Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Akiyama, Jun
  • Yoshida, Keita

Abstract

Provided is a pressure-sensitive adhesive sheet for processing a semiconductor element, which is capable of protecting a semiconductor element from electrostatic breakdown caused by peeling electrification and frictional electrification even under a high-humidity environment and/or under the application of a high voltage. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base material. A surface resistivity ρsBM of the base material and a surface resistivity ρsPA of the pressure-sensitive adhesive layer are each 1.0×1013Ω/□ or less. In one embodiment, a surface resistivity ρs10VBM of the base material at a time of application of 10 V and a surface resistivity ρs10VPA of the pressure-sensitive adhesive layer at a time of application of 10 V, and a surface resistivity ρs1000VBM 1,000 V and a surface resistivity ρs1000VPA 1,000 V satisfy the following expression (1) and expression (2). Provided is a pressure-sensitive adhesive sheet for processing a semiconductor element, which is capable of protecting a semiconductor element from electrostatic breakdown caused by peeling electrification and frictional electrification even under a high-humidity environment and/or under the application of a high voltage. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base material. A surface resistivity ρsBM of the base material and a surface resistivity ρsPA of the pressure-sensitive adhesive layer are each 1.0×1013Ω/□ or less. In one embodiment, a surface resistivity ρs10VBM of the base material at a time of application of 10 V and a surface resistivity ρs10VPA of the pressure-sensitive adhesive layer at a time of application of 10 V, and a surface resistivity ρs1000VBM 1,000 V and a surface resistivity ρs1000VPA 1,000 V satisfy the following expression (1) and expression (2). ρs 1000 ⁢ VBM / ρs 10 ⁢ VBM ≤ 1 , 000 ( 1 ) ρs 1000 ⁢ VPA / ρs 10 ⁢ VPA ≤ 1 , 000 ( 2 )

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

14.

SEPARATOR FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY

      
Application Number 18573492
Status Pending
Filing Date 2022-06-27
First Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yamada, Kyotaro
  • Takeda, Yuki
  • Haishi, Motoki
  • Furuta, Kenji

Abstract

A separator for a nonaqueous electrolyte secondary battery according to the present invention includes a porous base material, a metal layer situated over either or both of opposite surfaces of the porous base material, and a metal oxide layer situated either over one of opposite surfaces of the metal layer or over both of the opposite surfaces of the metal layer, the one being a surface opposite to a surface of the metal layer on a side of the porous base material.

IPC Classes  ?

  • H01M 50/457 - Separators, membranes or diaphragms characterised by the material having a layered structure comprising three or more layers
  • H01M 50/434 - Ceramics

15.

MULTILAYER BODY FOR BATTERY, AND METHOD FOR PRODUCING MULTILAYER BODY FOR BATTERY

      
Application Number 18573979
Status Pending
Filing Date 2022-06-27
First Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yamada, Kyotaro
  • Takeda, Yuki
  • Haishi, Motoki
  • Furuta, Kenji

Abstract

A multilayer body for a battery according to the present invention includes: a separator including a porous base material formed in a plate shape, and an inorganic material layer situated over either or both of opposite principal surfaces of the porous base material; and an organic support over which the separator is laminated.

IPC Classes  ?

  • H01M 50/451 - Separators, membranes or diaphragms characterised by the material having a layered structure comprising layers of only organic material and layers containing inorganic material
  • H01M 50/403 - Manufacturing processes of separators, membranes or diaphragms
  • H01M 50/489 - Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties

16.

PLASMA CVD APPARATUS

      
Application Number JP2024001178
Publication Number 2024/176666
Status In Force
Filing Date 2024-01-17
Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takazawa Masato
  • Seno Tomoyuki

Abstract

This plasma CVD apparatus 1a comprises a first roll 11, a second roll 12, a plasma generator 20, a first gas supply port 31, and a second gas supply port 32. The second roll 12 is disposed facing the first roll 11. The first gas supply port 31 and the second gas supply port 32 supply gas between the first roll 11 and the second roll 12. The first gas supply port 31 and the second gas supply port 32 are disposed on mutually opposite sides with respect to the plane P1 in the direction perpendicular to the plane P1.

IPC Classes  ?

  • C23C 16/54 - Apparatus specially adapted for continuous coating
  • C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
  • C23C 16/509 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes

17.

LAMINATE, LAMINATE PRODUCTION METHOD, AND POLARIZER WITH GAS-BARRIER LAYER

      
Application Number JP2024001359
Publication Number 2024/176674
Status In Force
Filing Date 2024-01-18
Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takazawa Masato
  • Seno Tomoyuki

Abstract

A laminate 1a comprises a substrate 2 and a gas-barrier layer 3. The gas-barrier layer 3 is formed on the substrate 2 and contains silicon, carbon, and oxygen. The gas-barrier layer 3 includes a layered first portion 3a, a layered second portion 3b, and a layered third portion 3c in the stated order toward the substrate 2 in the thickness direction of the gas-barrier layer 3. In the first portion 3a and the third portion 3c, the ratio R1 of the carbon content based on the number of atoms to the total silicon, carbon, and oxygen content based on the number of atoms is 0.1-20%. In the second portion 3b, the ratio R1 is less than 0.1%.

IPC Classes  ?

  • B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
  • C23C 16/42 - Silicides

18.

OPTICAL LAMINATE FOR OLED DISPLAY DEVICE

      
Application Number JP2024005866
Publication Number 2024/177024
Status In Force
Filing Date 2024-02-19
Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fuchida, Takehito
  • Miyamoto, Kodai

Abstract

Provided is an optical laminate for use in an OLED display device which does not use a polarizing plate and in which image blurring and white blurring do not readily occur even when having laminated therein a light scattering layer for suppressing interference variations and color shifting occurring when viewed in an oblique direction. The present invention provides an optical laminate which is for use in an OLED display device and in which only an optical element having a degree of polarization of 95% or less is laminated on the viewing side of an OLED element. The optical element has a reflection prevention layer and an adhesive layer having light scattering characteristics. In a reflectance spectrum of the OLED display device, when the maximum value at a wavelength of 380-455 nm is denoted as Rp1, the reflectance of the reflection prevention layer at the wavelength of Rp1 is denoted as Rf1, the maximum value at a wavelength of 460-530 nm is denoted as Rp2, the reflectance of the reflection prevention layer at the wavelength of Rp2 is denoted as Rf2, the distance between the adhesive layer and a color filter is denoted as d, and the haze value of the adhesive layer is denoted as H%, d×H×{(Rf1/Rp1)+(Rf2/Rp2)} ≤ 20000 is satisfied.

IPC Classes  ?

  • G02B 1/115 - Multilayers
  • B32B 7/023 - Optical properties
  • G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
  • H10K 50/854 - Arrangements for extracting light from the devices comprising scattering means
  • H10K 50/86 - Arrangements for improving contrast, e.g. preventing reflection of ambient light
  • H10K 59/10 - OLED displays
  • G02B 5/02 - Diffusing elements; Afocal elements

19.

GAS SEPARATION SYSTEM AND METHOD FOR SEPARATING MIXED GAS

      
Application Number JP2024005870
Publication Number 2024/177026
Status In Force
Filing Date 2024-02-19
Publication Date 2024-08-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor Katagiri Makoto

Abstract

The present invention provides a novel gas separation system suitable for efficiently separating a mixed gas. A gas separation system 100 according to the present invention comprises: a first separation membrane 11 that separates a mixed gas 70 into a first permeating gas 80 and a first non-permeating gas 81; and a second separation membrane 21 that separates the first non-permeating gas 81 into a second permeating gas 90 and a second non-permeating gas 91. The mixed gas 70 includes a gas A and a gas B different from the gas A. The first separation membrane 11 preferentially allows the gas A to permeate therethrough. The second separation membrane 21 preferentially allows the gas B to permeate therethrough. A separation coefficient α1 of the first separation membrane and a separation coefficient α2 of the second separation membrane satisfy the following relational expressions (1) and (2). Relational formula (1): α1/α2≧1.9. Relational formula (2): α2≦50.

IPC Classes  ?

  • B01D 53/22 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by diffusion
  • B01D 69/00 - Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
  • B01D 69/02 - Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor characterised by their properties
  • B01D 71/02 - Inorganic material
  • B01D 71/06 - Organic material
  • B01D 71/52 - Polyethers
  • B01D 71/56 - Polyamides, e.g. polyester-amides

20.

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

      
Application Number 18569093
Status Pending
Filing Date 2022-05-24
First Publication Date 2024-08-22
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takakura, Hayato
  • Shibata, Naoki
  • Fukui, Rei
  • Tanaka, Tomoaki

Abstract

A method for producing a wiring circuit board includes a first step of setting a pattern forming region and an opening forming region in a supporting layer; a second step of forming a base insulating layer on the supporting layer at least in the pattern forming region; a third step of forming, by electrolytic plating, a conductive pattern on the base insulating layer in the pattern forming region and a dummy pattern in the opening forming region; and a fourth step of etching at least a portion of the supporting layer in the opening forming region.

IPC Classes  ?

  • H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • C25D 5/02 - Electroplating of selected surface areas
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

21.

METHOD FOR PRODUCING OPTICAL FILM PIECE AND METHOD FOR MANAGING LONG OPTICAL FILM

      
Application Number JP2024003302
Publication Number 2024/171828
Status In Force
Filing Date 2024-02-01
Publication Date 2024-08-22
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Katayama Fumie
  • Kitagawa Takeharu
  • Goto Shusaku

Abstract

This method for producing an optical film piece comprises: a step for preparing a first long optical film which includes a phase difference member; and a step for forming slits in the first long optical film along the lengthwise direction thereof to obtain a plurality of second long optical films. The width of the first long optical film is at least than ten times the width of the optical film piece. The width of the second long optical films is 1.1-3.0 times the width of the optical film piece.

IPC Classes  ?

22.

MANUFACTURING METHOD FOR DISPLAY SYSTEM, AND OPTICAL FILM GROUP

      
Application Number JP2024003303
Publication Number 2024/171829
Status In Force
Filing Date 2024-02-01
Publication Date 2024-08-22
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Katayama Fumie
  • Mochizuki Masakazu
  • Kitagawa Takeharu
  • Goto Shusaku

Abstract

The present invention provides a manufacturing method for a display system displaying an image to a user and comprising a display element that has a display surface emitting light forward via a polarizing member, said light showing the image, a reflection-type polarizing member that is positioned in front of the display element and reflects the light emitted from the display element, a first lens part that is positioned on the optical path between the display element and the reflection-type polarizing member, a half mirror that is positioned between the display element and the first lens part, transmits the light emitted from the display element, and reflects, toward the reflection-type polarizing member, the light reflected by the reflection-type polarizing member, a first λ/4 member that is positioned on the optical path between the display element and the half mirror, and a second λ/4 member that is positioned on the optical path between the half mirror and the reflection-type polarizing member, said manufacturing method including: preparing a plurality of optical films that include the first λ/4 member, and sorting said optical films into a plurality of groups according to which have prescribed in-plane phase differences; preparing a plurality of optical films that include the second λ/4 member, and sorting said optical films into a plurality of groups according to which have prescribed in-plane phase differences; and selecting, from the plurality of groups of the optical films including the first λ/4 member and the plurality of groups of the optical films including the second λ/4 member, a combination of groups in which the in-plane phase differences match.

IPC Classes  ?

23.

PRODUCTION METHOD FOR OPTICAL FILM PIECE

      
Application Number JP2024003304
Publication Number 2024/171830
Status In Force
Filing Date 2024-02-01
Publication Date 2024-08-22
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Katayama Fumie
  • Kitagawa Takeharu
  • Goto Shusaku

Abstract

A production method for an optical film piece according to the present invention includes: a step for preparing a long optical film that includes a retardation member; a step for measuring the slow axis direction of the long optical film; and a step for conveying the long optical film in the lengthwise direction while continuously punching out optical film pieces such that the angle formed between a first direction of the optical film pieces and the slow axis direction is a prescribed angle, wherein only one optical film piece is punched out in the widthwise direction of the long optical film during the punching step.

IPC Classes  ?

24.

LIGHTING SPACE AND LIGHTING METHOD

      
Application Number JP2024004914
Publication Number 2024/172049
Status In Force
Filing Date 2024-02-14
Publication Date 2024-08-22
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Weng, Yufeng
  • Nakamura, Kozo
  • Inoue, Koichi

Abstract

Provided are: a lighting space that has visible anisotropic properties; and a lighting method. This lighting space comprises: a surface lighting device; and a first space and a second space that are partitioned by the surface lighting device. The surface lighting device comprises a light guide member for guiding light that is incident from a light source and outputting the same from a light output surface. The second space is lit with the light outputted from the light output surface, and (A/C)/(B/D) is greater than 1, where C is the luminance of a first object located in the first space, A is the luminance of the light output surface, D is the luminance of a second object located in the second space, and B is the luminance of a surface of the light guide member on the reverse side from the light output surface.

IPC Classes  ?

  • F21S 2/00 - Systems of lighting devices, not provided for in main groups  or , e.g. of modular construction
  • H05B 45/10 - Controlling the intensity of the light
  • F21Y 115/10 - Light-emitting diodes [LED]

25.

WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR RE-PEELING

      
Application Number 18430964
Status Pending
Filing Date 2024-02-02
First Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Chiba, Mizuho
  • Kitagawa, Taiki

Abstract

Provided are a water-dispersed pressure-sensitive adhesive composition excellent in dispersion stability and applicability, and a pressure-sensitive adhesive sheet for re-peeling using the water-dispersed pressure-sensitive adhesive composition. The water-dispersed pressure-sensitive adhesive composition includes: a water-dispersed acrylic polymer; an active energy ray-curable resin; and a photopolymerization initiator, wherein the water-dispersed acrylic polymer is a polymer obtained by subjecting a monomer composition containing (A) a carboxyl group-containing monomer represented by the formula (1) to emulsion polymerization: Provided are a water-dispersed pressure-sensitive adhesive composition excellent in dispersion stability and applicability, and a pressure-sensitive adhesive sheet for re-peeling using the water-dispersed pressure-sensitive adhesive composition. The water-dispersed pressure-sensitive adhesive composition includes: a water-dispersed acrylic polymer; an active energy ray-curable resin; and a photopolymerization initiator, wherein the water-dispersed acrylic polymer is a polymer obtained by subjecting a monomer composition containing (A) a carboxyl group-containing monomer represented by the formula (1) to emulsion polymerization: Provided are a water-dispersed pressure-sensitive adhesive composition excellent in dispersion stability and applicability, and a pressure-sensitive adhesive sheet for re-peeling using the water-dispersed pressure-sensitive adhesive composition. The water-dispersed pressure-sensitive adhesive composition includes: a water-dispersed acrylic polymer; an active energy ray-curable resin; and a photopolymerization initiator, wherein the water-dispersed acrylic polymer is a polymer obtained by subjecting a monomer composition containing (A) a carboxyl group-containing monomer represented by the formula (1) to emulsion polymerization: where R1 represents a hydrogen atom or a methyl group, R2 represents a divalent hydrocarbon group, “x” represents an integer of from 1 to 20, and “y” represents 0 or 1.

IPC Classes  ?

  • C09J 133/12 - Homopolymers or copolymers of methyl methacrylate
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters

26.

WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR RE-PEELING

      
Application Number 18430970
Status Pending
Filing Date 2024-02-02
First Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Chiba, Mizuho
  • Kitagawa, Taiki

Abstract

Provided are a water-dispersed pressure-sensitive adhesive composition excellent in water resistance, and a pressure-sensitive adhesive sheet for re-peeling using the water-dispersed pressure-sensitive adhesive composition. The water-dispersed pressure-sensitive adhesive composition includes: a water-dispersed acrylic polymer; an active energy ray-curable resin; and a photopolymerization initiator, wherein the active energy ray-curable resin is an emulsion containing a tetrafunctional or higher radically polymerizable monomer and a urethane acrylate.

IPC Classes  ?

27.

PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number 18430979
Status Pending
Filing Date 2024-02-02
First Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kitagawa, Taiki
  • Chiba, Mizuho

Abstract

Provided is a pressure-sensitive adhesive sheet excellent in water resistance. The pressure-sensitive adhesive sheet includes: a base material; and a pressure-sensitive adhesive layer formed of a water-dispersed pressure-sensitive adhesive composition including a water-dispersed acrylic polymer, an active energy ray-curable resin, and a photopolymerization initiator. The pressure-sensitive adhesive sheet has a pressure-sensitive adhesive strength maintenance ratio of 75% or more, which is calculated from the following equation: Pressure-sensitive adhesive strength maintenance ratio (%)={pressure-sensitive adhesive strength before immersion in water at 23° C. for 30 minutes (N/20 mm)/pressure-sensitive adhesive strength after immersion in water at 23° C. for minutes (N/20 mm)}×100.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters

28.

BONDING SHEET AND METHOD FOR PRODUCING SAME

      
Application Number 18281221
Status Pending
Filing Date 2022-03-07
First Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kato, Masatoshi
  • Nitta, Ayumi
  • Kosaka, Naofumi

Abstract

A bonding sheet according to the present invention contains a matrix resin; solder particles; and a fluxing agent. In the bonding sheet, the solder particles are dispersed in the matrix resin, and the fluxing agent is unevenly distributed around the solder particles in the matrix resin. The method for producing the bonding sheet of the present invention includes a first step of dissolving a fluxing agent in a first solvent to prepare a fluxing agent solution; a second step of mixing a second solvent, a matrix resin component, solder particles, and the fluxing agent solution to prepare a mixed composition; and a third step of applying the mixed composition onto a substrate to form a coated film, and then drying the coated film to form a bonding sheet.

IPC Classes  ?

  • B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
  • B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
  • B23K 35/362 - Selection of compositions of fluxes
  • C09J 7/35 - Heat-activated
  • C09J 9/02 - Electrically-conducting adhesives
  • C09J 11/04 - Non-macromolecular additives inorganic
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 163/00 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
  • C22C 12/00 - Alloys based on antimony or bismuth
  • H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
  • H05K 3/36 - Assembling printed circuits with other printed circuits

29.

SEPARATION FUNCTION LAYER AND SEPARATION MEMBRANE

      
Application Number JP2024000643
Publication Number 2024/166604
Status In Force
Filing Date 2024-01-12
Publication Date 2024-08-15
Owner
  • NITTO DENKO CORPORATION (Japan)
  • NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY (Japan)
Inventor
  • Yasui Tomoki
  • Ito Yuri
  • Nishiyama Shinya
  • Kamio Eiji
  • Kobayashi Kan
  • Matsuyama Hideto

Abstract

The present invention provides a new separation function layer that is suited for separating an acidic gas from a gas mixture that includes the acidic gas. A separation function layer 1 according to the present invention comprises: an ionic liquid L; a hydrophilic polymer A that forms a crystal structure in the ionic liquid L; and a polymer B that is different from the polymer A. A separation membrane 10 according to the present invention comprises: the separation function layer 1; and a porous support 3 that supports the separation function layer 1.

IPC Classes  ?

  • B01D 71/06 - Organic material
  • B01D 69/00 - Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
  • B01D 69/10 - Supported membranes; Membrane supports
  • B01D 69/12 - Composite membranes; Ultra-thin membranes
  • B01D 71/38 - Polyalkenylalcohols; Polyalkenylesters; Polyalkenylethers; Polyalkenylaldehydes; Polyalkenylketones; Polyalkenylacetals; Polyalkenylketals
  • B01D 71/44 - Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, not provided for in a single one of groups
  • C08L 29/04 - Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
  • C08L 39/06 - Homopolymers or copolymers of N-vinyl-pyrrolidones

30.

LIGHT CONTROL FILM

      
Application Number JP2024002010
Publication Number 2024/166684
Status In Force
Filing Date 2024-01-24
Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fujino, Nozomi
  • Tanabe, Ryosuke
  • Takeyasu, Tomohiro

Abstract

A light control film (X) according to the present invention comprises, in order in the thickness direction (H), a substrate film (10), an electrode layer (20), a light control layer (30), and an electrode layer (40). The electrode layer (20) is an indium-tin complex oxide layer in which the percentage of tin oxide is 11 mass% or greater. The electrode layer (20) has a number of carriers that is greater than or equal to 10×1015cm–2.

IPC Classes  ?

  • G02F 1/155 - Electrodes
  • B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
  • B32B 7/023 - Optical properties
  • G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
  • G02F 1/1343 - Electrodes

31.

BIOSENSOR

      
Application Number JP2024003371
Publication Number 2024/166794
Status In Force
Filing Date 2024-02-01
Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor Kondo, Sota

Abstract

A biosensor (1) according to the present invention is to be adhered to a living body and comprises: a sensor body (32) that acquires biological information; a first layer member (10) that has a protruding shape so as to cover the sensor body (32); a second layer member (40) that is adhered to the surface of the first layer member (10) on the opposite side from the protruding direction thereof and has an adhering surface to be adhered to the living body; and an accommodation space (S) for the sensor body (32) that is enclosed by the first layer member (10) and the second layer member (40), wherein the amount of water vapor permeating into the accommodation space (S) through the second layer member (40) at a first temperature is less than the amount of water vapor coming out from the accommodation space (S) through the first layer member (10) at a second temperature which is lower than the first temperature.

IPC Classes  ?

  • A61B 5/257 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes

32.

MANAGEMENT SYSTEM AND MANAGEMENT METHOD

      
Application Number JP2024003372
Publication Number 2024/166795
Status In Force
Filing Date 2024-02-01
Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor Mitsuyasu, Uday

Abstract

Provided is a management system in which a management device and terminal devices are connected via a network, the management device comprising: a transmission permission unit that receives, from a terminal device, a transmission request requesting permission to transmit measurement data acquired by a medical device to a destination of the measurement data, refers to a storage unit that stores information indicating the usage status of the medical device, and permits uploading of the measurement data to the destination when the usage status of the medical device corresponding to the transmission request is in a prescribed state; and an output unit that outputs, to the terminal device, a permission notification that permits uploading of the measurement data to the destination of the measurement data.

IPC Classes  ?

  • G16H 10/60 - ICT specially adapted for the handling or processing of patient-related medical or healthcare data for patient-specific data, e.g. for electronic patient records

33.

BIOLOGICAL SENSOR

      
Application Number JP2024003561
Publication Number 2024/166828
Status In Force
Filing Date 2024-02-02
Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor Kondo, Sota

Abstract

A biological sensor according to the present invention is intended to be affixed to a living body. The biological sensor comprises: a sensor body that acquires biological information; an electrode connected to the sensor body; a first layer member having the electrode on the lower surface thereof and including a housing section that forms a housing space in which the the sensor body is housed; and a second layer member attached so as to cover the sensor body while allowing the electrode to be exposed on the lower surface of the first layer member. The second layer member has a second adhesive layer on a surface thereof which is in the opposite side of the first layer member. The second adhesive layer has, in a surface thereof which is in the opposite side of the first layer member, a groove section in which adhesive portions having adhesive properties and non-adhesive portions having no adhesive properties are arranged. The ratio of the width of the adhesive portion to the width of the non-adhesive portion is 2.0 to 8.0. The width of the non-adhesive portion is 1.0 mm to 1.5 mm.

IPC Classes  ?

  • A61B 5/257 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes

34.

MANAGEMENT SYSTEM, MANAGEMENT METHOD

      
Application Number JP2024003842
Publication Number 2024/166897
Status In Force
Filing Date 2024-02-06
Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor Kato, Shinji

Abstract

This management system in which a management device and a terminal device are connected by a network, the management device having: an identification information issue unit that receives, from the terminal device, input of information relating to a destination to which medical equipment is supplied, and issues first identification information for identifying the destination to which the medical equipment is supplied and second identification information for identifying measurement data acquired by the medical equipment; and a storage control unit for storing, in a memory unit, state management information in which unique identification information that identifies medical equipment, the first identification information, and the second identification information are associated with each other.

IPC Classes  ?

  • G16H 10/60 - ICT specially adapted for the handling or processing of patient-related medical or healthcare data for patient-specific data, e.g. for electronic patient records

35.

LIGHT GUIDE MEMBER FOR ILLUMINATION DEVICE, AND ILLUMINATION DEVICE

      
Application Number 18568344
Status Pending
Filing Date 2022-06-08
First Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Inoue, Koichi
  • Weng, Yufeng
  • Nakamura, Kozo

Abstract

A lightguide component for illumination devices having first and second exit surfaces at opposite sides, the lightguide component including: a light-receiving portion to receive light emitted from a light source; a lightguide layer having a first principal face at the first exit surface side and a second principal face at the second exit surface side; and a light distribution controlling structure having a plurality of internal spaces. Each of the plurality of internal spaces includes a first slope to direct a portion of light propagating in the lightguide layer toward the first exit surface via total internal reflection, and a second slope at an opposite side from the first slope, and the lightguide component is configured to emit first light having a first intensity distribution through the first exit surface and to emit second light having a second intensity distribution through the second exit surface.

IPC Classes  ?

  • F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
  • G02B 1/11 - Anti-reflection coatings

36.

METHOD FOR DIVIDING COMPOSITE MATERIAL

      
Application Number 18568385
Status Pending
Filing Date 2022-03-29
First Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Hirata, Satoshi
  • Kanno, Toshihiro
  • Yano, Takanobu

Abstract

A method for dividing a composite material 10 in which a brittle material layer 1 and a resin layer 2 are laminated, the method including: a brittle material removing step in which irradiation is performed from a brittle material layer side with a laser beam L1, which is oscillated from an ultrashort pulse laser light source 20, along a scheduled dividing line DL of the composite material to form a scribe groove 11; and a resin removing step in which the resin layer is irradiated with a laser beam L2, which is oscillated from a laser light source 30, along the scheduled dividing line to remove a resin forming the resin layer.

IPC Classes  ?

  • C03B 33/07 - Cutting armoured or laminated glass products
  • B23K 26/38 - Removing material by boring or cutting
  • B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
  • C03B 33/02 - Cutting or splitting sheet glass; Apparatus or machines therefor
  • C03B 33/033 - Apparatus for opening score lines in glass sheets

37.

LIGHT CONTROL FILM

      
Application Number JP2024002009
Publication Number 2024/166683
Status In Force
Filing Date 2024-01-24
Publication Date 2024-08-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fujino, Nozomi
  • Tanabe, Ryosuke
  • Takeyasu, Tomohiro

Abstract

A light control film (X) according to the present invention is provided with a base material film (10), an electrode layer (20), a light control layer (30) and an electrode layer (40) in this order in the thickness direction (H). The electrode layer (20) is an indium-containing conductive oxide layer. The electrode layer (20) has a specific resistance of 2.5 × 10-4 Ω∙cm or less. The electrode layer (20) is a crystalline layer that has an average crystal grain size of 300 nm or less in the plane direction, and has a region that contains a plurality of crystal grains in the thickness direction (H).

IPC Classes  ?

  • G02F 1/155 - Electrodes
  • B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
  • B32B 7/023 - Optical properties
  • G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
  • G02F 1/1343 - Electrodes

38.

BIOSENSOR SYSTEM, BIOSENSOR, TERMINAL DEVICE, AND BIOMETRIC DATA MANAGEMENT METHOD FOR BIOSENSOR SYSTEM

      
Application Number JP2024003789
Publication Number 2024/166887
Status In Force
Filing Date 2024-02-06
Publication Date 2024-08-15
Owner
  • NITTO DENKO CORPORATION (Japan)
  • SPCHANGE, LLC. (Japan)
Inventor
  • Hirai, Yusaku
  • Kamata, Takatsugu
  • Ueda, Masayuki
  • Yokoyama, Hiromi
  • Mitsuyasu, Uday

Abstract

This biosensor system comprises: a biosensor; and a terminal device that receives biometric data from the biosensor. Either the biosensor or the terminal device determines a measurement start time of the biometric data on the basis of a time when a data transfer request occurred, a measurement time of biometric information, and a first count value of a counter from the completion of measurement of the biometric information until the biosensor receives the data transfer request, or on the basis of the time when the data transfer request occurred, and a second count value of the counter from the start of measurement of the biometric information until the biosensor receives the data transfer request. Thereby, it is possible to accurately link biometric information and biometric information acquisition time, while suppressing battery consumption.

IPC Classes  ?

  • A61B 5/332 - Portable devices specially adapted therefor
  • A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
  • A61B 5/333 - Recording apparatus specially adapted therefor

39.

WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR RE-PEELING

      
Application Number 18430956
Status Pending
Filing Date 2024-02-02
First Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Chiba, Mizuho
  • Kitagawa, Taiki

Abstract

Provided are: a water-dispersed pressure-sensitive adhesive composition that has an excellent pressure-sensitive adhesive strength, and that can achieve both of adhesiveness to an adherend and peelability; and a pressure-sensitive adhesive sheet for re-peeling using the water-dispersed pressure-sensitive adhesive composition. The water-dispersed pressure-sensitive adhesive composition includes: a water-dispersed acrylic polymer; an active energy ray-curable resin; and a photopolymerization initiator, wherein the water-dispersed acrylic polymer is a polymer having two or more glass transition temperatures.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters

40.

PAINT-PROTECTIVE COATING MATERIAL AND COATING COMPOSITION

      
Application Number 18561059
Status Pending
Filing Date 2022-05-13
First Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Igarashi, Takeshi
  • Hashimoto, Koki
  • Imoto, Eiichi
  • Yoshida, Chihiro

Abstract

Provided is a paint-protective coating material formed from a liquid coating composition. The coating composition comprises, as its base polymer, a polymer (A) that is a polymerization product of monomers comprising an acrylic monomer. The paint-protective coating material has a storage modulus at 70° C. of 0.40 MPa or higher and 1.30 or lower, a storage modulus at 23° C. of 250 MPa or higher and 800 MPa or lower, and a storage modulus at −30° C. of 2300 MPa or less.

IPC Classes  ?

  • C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
  • C08F 218/08 - Vinyl acetate
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C09D 5/02 - Emulsion paints

41.

IMAGE CLASSIFICATION DEVICE, IMAGE CLASSIFICATION METHOD, INSPECTION SYSTEM, AND PROGRAM

      
Application Number JP2023040348
Publication Number 2024/161744
Status In Force
Filing Date 2023-11-09
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Soga, Kazuki
  • Kigawa, Yoichi

Abstract

Provided is image classification technology that can effectively determine the timing at which to re-train a trained model. This image classification device comprises: a feature value extraction unit that, by using teacher data obtained as a result of teacher images being assigned teacher labels indicating any among a plurality of classes, extracts an image feature value from a target image on the basis of a trained model that has been trained such that the distance between the teacher images to which are assigned teacher labels indicating different classes becomes greater; a class determination unit that classifies the target image as an unknown image on the basis of the distance between the image feature value and the feature value representing the class; and a result output unit that outputs information relating to the number of unknown images.

IPC Classes  ?

  • G06V 10/764 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
  • G06T 7/00 - Image analysis

42.

METHOD FOR PRODUCING MULTILAYER FILM HAVING ADHESIVE LAYER

      
Application Number JP2023043743
Publication Number 2024/161789
Status In Force
Filing Date 2023-12-07
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tsutsumi, Kiyotaka
  • Michishita, Sora
  • Yamamoto, Shinya

Abstract

A method for producing a multilayer film according to the present invention comprises a preparation step and an outer shape processing step. In the preparation step, a long work film (W) (a carrier film (C)/a film layer (10)/an adhesive layer (20)/a film layer (30)) is prepared. The adhesive layer (20) has a shear storage elastic modulus of 100 kPa or less at 25°C. In the outer shape processing step, the work film (W) is irradiated and scanned with a laser beam (L) from the film layer (30) side, and a portion from the film layer (30) to the film layer (10) is fused on the carrier film (C). Consequently, a multilayer sheet (X) is formed. The multilayer sheet (X) comprises a film (11) that has an extended end part (11A). The spot diameter of the laser beam (L), with which the work film (W) is irradiated, is 200 to 500 µm on a film layer (30)-side surface (20b) of the adhesive layer (20).

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
  • B23K 26/70 - Auxiliary operations or equipment
  • B32B 38/18 - Handling of layers or the laminate
  • C09J 7/10 - Adhesives in the form of films or foils without carriers

43.

ADHESIVE COMPOSITION AND ADHESIVE SHEET

      
Application Number JP2023046374
Publication Number 2024/161866
Status In Force
Filing Date 2023-12-25
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Nakagawa, Muneshige
  • Tamura, Akinori
  • Yamaguchi, Tomoo
  • Hatanaka, Itsuhiro

Abstract

Provided is an adhesive composition with which can be formed an adhesive having both adhesiveness to soft and rough surfaces and anti-blocking properties. The provided adhesive composition contains: a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound; a tackifying resin; a softener; and a filler. In the adhesive composition, the content of the tackifying resin is 45-150 parts by weight per 100 parts by weight of the block copolymer. The content of the softener is 3-45 parts by weight per 100 parts by weight of the block copolymer. The content of the filler is 3-70 parts by weight per 100 parts by weight of the block copolymer.

IPC Classes  ?

44.

PRODUCTION METHOD FOR ORGANIC COMPOUND, AND FLOW REACTOR

      
Application Number JP2023046825
Publication Number 2024/161880
Status In Force
Filing Date 2023-12-26
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Hirano Makoto
  • Wada Kazuhito
  • Matsuda Hirokazu
  • Afreen Gul
  • Bansode Atul
  • Urakawa Atsushi

Abstract

A production method for an organic compound according to the present invention is a method for producing an organic compound using a catalyst. This production method includes causing a gaseous phase, an aqueous phase, and an organic phase to pass through a flow reactor to synthesize an organic compound from a starting compound included in a raw material. A flow reactor according to the present invention is for producing an organic compound using a catalyst, and a gaseous phase, an aqueous phase, and an organic phase pass through the inside of the flow reactor when synthesizing an organic compound from a starting compound.

IPC Classes  ?

  • C07C 51/00 - Preparation of carboxylic acids or their salts, halides, or anhydrides
  • B01J 8/06 - Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with stationary particles, e.g. in fixed beds the solid particles being arranged in tubes
  • B01J 31/22 - Organic complexes
  • B01J 31/24 - Phosphines
  • C07B 61/00 - Other general methods
  • C07C 53/06 - Salts thereof

45.

ADHESIVE SHEET

      
Application Number JP2024000152
Publication Number 2024/161910
Status In Force
Filing Date 2024-01-09
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tagami, Toru
  • Imoto, Eiichi
  • Yamamoto, Kenichi
  • Nagura, Shun

Abstract

Provided is an adhesive sheet that has an adhesive agent layer containing an acrylic polymer. Monomer components of the acrylic polymer include 2-octyl acrylate (m1), and at least 10 wt% of a co-polymerizable monomer (m3) that is different from the 2-octyl acrylate (m1) and a carboxy group-containing monomer (m2). The adhesive agent layer further contains a tackifier.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 11/08 - Macromolecular additives
  • C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters

46.

COMPONENT AND ASSEMBLY

      
Application Number JP2024003576
Publication Number 2024/162474
Status In Force
Filing Date 2024-02-02
Publication Date 2024-08-08
Owner
  • NITTO DENKO CORPORATION (Japan)
  • FUJIKURA COMPOSITES INC. (Japan)
Inventor
  • Uemura Kou
  • Fujita Hiroyuki
  • Tsuchiya Kouji
  • Izawa Kenji

Abstract

A component 1a includes a fixed member 10 and a cover 20. The fixed member 10 is solely fixed to a housing 2 so as to cover an opening 2a of the housing 2. The cover 20 covers the fixed member 10.

IPC Classes  ?

  • H05K 5/06 - Hermetically-sealed casings
  • F16K 24/00 - Devices, e.g. valves, for venting or aerating enclosures
  • F16K 24/04 - Devices, e.g. valves, for venting or aerating enclosures for venting only
  • H01M 50/153 - Lids or covers characterised by their shape for button or coin cells
  • H01M 50/184 - Sealing members characterised by their shape or structure
  • H01M 50/317 - Re-sealable arrangements
  • H05K 5/03 - Covers

47.

WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR RE-PEELING

      
Application Number 18430933
Status Pending
Filing Date 2024-02-02
First Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Chiba, Mizuho
  • Kitagawa, Taiki

Abstract

Provided are: a water-dispersed pressure-sensitive adhesive composition that is excellent in applicability and that can achieve both of adhesiveness to an adherend and re-peelability; and a pressure-sensitive adhesive sheet for re-peeling using the water-dispersed pressure-sensitive adhesive composition. The water-dispersed pressure-sensitive adhesive composition includes: a water-dispersed acrylic polymer; an active energy ray-curable resin; and a photopolymerization initiator, wherein the water-dispersed acrylic polymer is a polymer obtained by subjecting a monomer composition containing a methacrylic acid ester having 2 or less carbon atoms to emulsion polymerization.

IPC Classes  ?

  • C09J 133/10 - Homopolymers or copolymers of methacrylic acid esters
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters

48.

PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number 18430976
Status Pending
Filing Date 2024-02-02
First Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Chiba, Mizuho
  • Kitagawa, Taiki

Abstract

Provided is a pressure-sensitive adhesive sheet that is excellent in anchoring strength between a base material and a pressure-sensitive adhesive layer, and that is suppressed from causing an adhesive residue at the time of its peeling. The pressure-sensitive adhesive sheet includes: a base material; and a pressure-sensitive adhesive layer formed of a water-dispersed pressure-sensitive adhesive composition including a water-dispersed acrylic polymer, an active energy ray-curable resin, and a photopolymerization initiator. The pressure-sensitive adhesive sheet has a change ratio of −50% or more, which is calculated from the following equation: Change ratio (%)={(anchoring strength after UV irradiation-anchoring strength before UV irradiation)/anchoring strength before UV irradiation}×100.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 7/22 - Plastics; Metallised plastics
  • C09J 11/06 - Non-macromolecular additives organic

49.

ADHESIVE SHEET

      
Application Number JP2024000153
Publication Number 2024/161911
Status In Force
Filing Date 2024-01-09
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tagami, Toru
  • Imoto, Eiichi
  • Yamamoto, Kenichi
  • Nagura, Shun

Abstract

Provided is an adhesive sheet having an adhesive layer. The adhesive layer includes an acrylic polymer which contains 2-Octyl acrylate as a monomer component. Moreover, the acrylic polymer contains 0-20 mass% alkyl (meth)acrylate as another monomer component different from 2-Octyl acrylate. The adhesive layer further includes a tackifier.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 11/08 - Macromolecular additives
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters

50.

ADHESIVE COMPOSITION, JOINED BODY, ROTOR, AND DISASSEMBLY METHOD

      
Application Number JP2024002655
Publication Number 2024/162263
Status In Force
Filing Date 2024-01-29
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Suzuki Yuto
  • Ueda Satoshi

Abstract

The present invention provides an adhesive composition that has excellent heat resistance and can easily disassemble adherends from each other by heating. The present invention further provides a joined body adhered by a cured product of the adhesive composition, a rotor, and a disassembly method. The present invention relates to an adhesive composition containing a curable resin, wherein the glass transition temperature of a cured product obtained by curing the adhesive composition is 150°C or higher, and the shear adhesive power of the cured product after heating at 300°C is 1 MPa or lower.

IPC Classes  ?

  • C09J 201/00 - Adhesives based on unspecified macromolecular compounds
  • C09J 11/04 - Non-macromolecular additives inorganic
  • C09J 11/08 - Macromolecular additives
  • C09J 163/00 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
  • C09J 163/04 - Epoxynovolacs
  • H02K 1/276 - Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
  • H02K 15/03 - Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies having permanent magnets

51.

PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number JP2024002668
Publication Number 2024/162266
Status In Force
Filing Date 2024-01-29
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kumakura, Kenta
  • Honda, Satoshi
  • Nagaida, Miyabi

Abstract

150-5180-120180-120 after heating at 180 °C for 120 minutes are 50% or more.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
  • C09J 11/04 - Non-macromolecular additives inorganic
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 201/00 - Adhesives based on unspecified macromolecular compounds

52.

ADHESIVE SHEET

      
Application Number JP2024002669
Publication Number 2024/162267
Status In Force
Filing Date 2024-01-29
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kumakura, Kenta
  • Honda, Satoshi
  • Nagaida, Miyabi

Abstract

Provided is an adhesive sheet comprising an adhesive layer that includes a polymer, a monomer, and a thermal polymerization initiator. The polymer includes an ethylenically unsaturated group, and the monomer also includes an ethylenically unsaturated group. The thermal polymerization initiator includes a peroxide-based polymerization initiator.

IPC Classes  ?

53.

BIOSENSOR

      
Application Number JP2024002812
Publication Number 2024/162328
Status In Force
Filing Date 2024-01-30
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor Kondo, Sota

Abstract

A biosensor according to the present invention is affixed to a living body and comprises: an electrode provided to the living body side of a sensor body for acquiring biological information; and a base material that is provided on the electrode on the living body side thereof or the side thereof opposite from the living body, and that has an exposing section that exposes a portion of the electrode. The electrode contacts the sensor body or the living body via the exposing section.

IPC Classes  ?

  • A61B 5/259 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes using conductive adhesive means, e.g. gels
  • A61B 5/268 - Bioelectric electrodes therefor characterised by the electrode materials containing conductive polymers, e.g. PEDOT:PSS polymers
  • A61B 5/273 - Connection of cords, cables or leads to electrodes

54.

BIOLOGICAL SENSOR

      
Application Number JP2024002813
Publication Number 2024/162329
Status In Force
Filing Date 2024-01-30
Publication Date 2024-08-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor Kondo, Sota

Abstract

A biological sensor according to the present invention is for affixation to a living body, said biological sensor comprising: a sensor body that acquires biological information; a first base material that is flexible; a first housing that is provided on the living body side; and a second housing that is provided on the side opposite from the living body. The first housing and/or the second housing has a projection that is inserted into a through hole of the first base material. The first housing and/or the second housing has a locking part that locks the projection. The first base material is pressed by the first housing and the second housing in a state where the projection is locked by the locking part.

IPC Classes  ?

  • A61B 5/259 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes using conductive adhesive means, e.g. gels
  • A61B 5/268 - Bioelectric electrodes therefor characterised by the electrode materials containing conductive polymers, e.g. PEDOT:PSS polymers
  • A61B 5/273 - Connection of cords, cables or leads to electrodes
  • A61B 5/276 - Protection against electrode failure
  • A61B 5/332 - Portable devices specially adapted therefor

55.

SWITCH DEVICE AND ELEMENT DEVICE

      
Application Number JP2024002118
Publication Number 2024/158021
Status In Force
Filing Date 2024-01-24
Publication Date 2024-08-02
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Murashige, Takeshi
  • Nishimori, Toshimasa

Abstract

This switch device has a glass layer that is provided with one continuous surface, a resin layer that is stacked on the rear surface-side of the glass layer, and a physical switch and a touch switch that are positioned at non-overlapping positions on the rear surface-side of the resin layer. The thickness of the glass layer is 20-150 μm. The physical switch is provided with a plurality of contact points, including contact points that are capable of moving vertically. When the glass layer positioned above the physical switch is pressed, the glass layer and the resin layer elastically deform, and the plurality of contact points switch between conduction and non-conduction.

IPC Classes  ?

  • H01H 13/704 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
  • H01H 13/02 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch - Details
  • H01H 13/14 - Operating parts, e.g. push-button

56.

PIEZOELECTRIC LAYER FABRICATION METHOD AND BULK ACOUSTIC WAVE FILTER MANUFACTURING METHOD USING SAME

      
Application Number JP2023002532
Publication Number 2024/157430
Status In Force
Filing Date 2023-01-26
Publication Date 2024-08-02
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yanagitani, Takahiko
  • Tokai, Satoshi

Abstract

This piezoelectric layer fabrication method comprises: a substrate preparation step for preparing a substrate (11) that is formed from a single crystal having a crystal structure with three-fold rotational symmetry or six-fold rotational symmetry around an axis perpendicular to a prescribed plane, and has said prescribed plane on a surface thereof; a sacrificial layer fabrication step for fabricating a sacrificial layer (13) on the substrate (11) by means of an epitaxial method; a piezoelectric layer fabrication step for fabricating an epitaxial zinc oxide piezoelectric layer (14) that is a layer of zinc oxide on the sacrificial layer (13) by means of the epitaxial method; and a sacrificial layer dissolution step for selectively dissolving the sacrificial layer (13). By fabricating an acoustic Bragg reflector (16) on the epitaxial zinc oxide piezoelectric layer (14) between the piezoelectric layer fabrication step and the sacrificial layer dissolution step, it is possible to manufacture a bulk acoustic wave filter (10).

IPC Classes  ?

  • H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

57.

LAMINATED FILM HAVING ADHESIVE LAYER

      
Application Number JP2023043860
Publication Number 2024/157621
Status In Force
Filing Date 2023-12-07
Publication Date 2024-08-02
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tsutsumi, Kiyotaka
  • Michishita, Sora
  • Yamamoto, Shinya

Abstract

The laminated film (X) comprises a film (10), an adhesive layer (20), and a film (30). The film (10) contacts a first surface (21) of the adhesive layer (20). The film (30) contacts a second surface (22) of the adhesive layer (20). The film (10) has an extended end (12). The extended end (12) extends outward from an end surface (23) of the adhesive layer (20) in a plane direction (D) perpendicular to the thickness direction (H). The extended end (12) has a surface (12a) that connects flush with the end surface (23) and is thinner than the main region (11) of the film (10) in contact with the adhesive layer (20).

IPC Classes  ?

  • C09J 7/40 - Adhesives in the form of films or foils characterised by release liners
  • B32B 3/02 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

58.

METHOD FOR MANUFACTURING LAMINATE FILM HAVING ADHESIVE LAYER

      
Application Number JP2023043861
Publication Number 2024/157622
Status In Force
Filing Date 2023-12-07
Publication Date 2024-08-02
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tsutsumi, Kiyotaka
  • Michishita, Sora
  • Yamamoto, Shinya

Abstract

This method for manufacturing a laminate film includes a half-cut step and a full-cut step. In the half-cut step, a work film (W) in which a carrier film (C), a film layer (10), an adhesive layer (20), and a film layer (30) are provided in this order in the thickness direction (H), is irradiated and scanned with laser light (L1) from the film layer (30) side, and consequently the film layer (10) and the adhesive layer (20) are melted to form a half-cut groove (G1). In the full-cut step, the work film (W) is irradiated and scanned with laser light (L2) from the film layer (30) side, and consequently the film layer (30), the adhesive layer (20) and the film layer (10) are melted to form a full-cut groove (G2). The half-cut groove (G1) and the full-cut groove (G2) extend adjacent and in parallel to each other, and in the extending direction, are continuously linked in the adjacent direction.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
  • B23K 26/70 - Auxiliary operations or equipment
  • B32B 38/18 - Handling of layers or the laminate
  • C09J 7/10 - Adhesives in the form of films or foils without carriers

59.

BULK ACOUSTIC WAVE FILTER AND METHOD FOR MANUFACTURING SAME

      
Application Number JP2024001898
Publication Number 2024/157984
Status In Force
Filing Date 2024-01-23
Publication Date 2024-08-02
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yanagitani, Takahiko
  • Tokai, Satoshi

Abstract

The present invention comprises: an acoustic Bragg reflector (12) in which a plurality of first acoustic impedance layers (121) and second acoustic impedance layers (122) are alternately layered one by one, each of said impedance layers being composed of a metal polycrystal or single crystal that is oriented in a predetermined direction, and having a different acoustic impedance than the other; and a piezoelectric layer (14) that is provided on the acoustic Bragg reflector (12) and is composed of a polycrystal or a single crystal piezoelectric material that is oriented in a predetermined direction, the crystal lattice of the polycrystal or the single crystal matching the crystal lattice of the metal polycrystal or single crystal of a layer among the first acoustic impedance layers and the second acoustic impedance layers that is at a position close to the piezoelectric layer.

IPC Classes  ?

  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

60.

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

      
Application Number 18007388
Status Pending
Filing Date 2021-05-24
First Publication Date 2024-08-01
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takimoto, Kenya
  • Shibata, Naoki
  • Takakura, Hayato

Abstract

Provided is a method for producing a wiring circuit board that includes the steps of forming a first metal layer on a metal supporting substrate; forming an insulating layer on the first metal layer; removing a portion of the first metal layer, the portion being exposed at the opening portion of the insulating layer, to expose the metal supporting substrate at the opening portion; forming a second metal layer on a portion of the metal supporting substrate exposed at the opening portion and on the insulating layer; and forming a conductive layer on the second metal layer. A wiring circuit board includes the metal supporting substrate, the first metal layer having a first opening portion, the insulating layer having a second opening portion having an opening along the first opening portion, the second metal layer connected to the metal supporting substrate, and the conductive layer on the second metal layer.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

61.

LAMINATE AND ELECTROMAGNETIC WAVE ABSORBER

      
Application Number 18019182
Status Pending
Filing Date 2021-07-28
First Publication Date 2024-08-01
Owner
  • Nitto Denko Corporation (Japan)
  • OSAKA UNIVERSITY (Japan)
Inventor
  • Kamano, Yusuke
  • Masuda, Shotaro
  • Nagai, Masaya
  • Nagatsuma, Tadao
  • Fujita, Masayuki

Abstract

According to the present invention, a laminate has: a fiber aggregate including a plurality of nanofibers aggregated into a sheet; and a reflective substrate on which the fiber aggregate is placed and which has a reflectance of 0.1% or more. In this laminate, the fiber aggregate includes: a first orientation part formed in a part of a thickness direction of the fiber aggregate; and a second orientation part formed nearer to the reflective substrate than the first orientation part and having a lower degree of orientation than the first orientation part.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • H01B 1/04 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon, or silicon
  • H01Q 17/00 - Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems

62.

METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET

      
Application Number 18561206
Status Pending
Filing Date 2022-01-21
First Publication Date 2024-08-01
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tamaki, Yusaku
  • Fukushima, Rihito
  • Niino, Teppei

Abstract

A method for producing a wiring circuit board assembly sheet includes a marking step of forming a mark made of a recessed portion in a metal support board, and after the marking step, an insulating layer forming step of forming a base insulating layer on one surface in a thickness direction of the metal support board formed with the mark.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

63.

SYSTEMS AND METHODS FOR IN-TIRE WHEEL FORCE TRANSDUCER

      
Application Number US2024012043
Publication Number 2024/155831
Status In Force
Filing Date 2024-01-18
Publication Date 2024-07-25
Owner
  • NITTO BEND TECHNOLOGIES, INC. (USA)
  • NITTO DENKO CORPORATION (Japan)
Inventor
  • Belknap, Juma
  • Bortell, John
  • Delos Santos, Benedicto
  • Jonas, Jared K.
  • Ottley, Colton A.
  • Briggs, Nathan

Abstract

A sensor module for estimating one or more parameters of a tire, the sensor module including a detector patch comprising a contact patch and a sidewall patch each having one or more extensible capacitors that have an electrostatic capacity that is variable due to at least deformation of the respective one of the contact patch and the sidewall patch, and a power source, an electronics unit in electronic communication with the power source and the detector patch and configured to control the sensor module, wherein the detector patch is configured to be adhered to an inside of a tire so that the contact patch contacts an inside.of a tread portion and the sidewall patch contacts an inside of a sidewall portion and the electronics unit is configured to estimate at least one of the parameters of the tire using the electrostatic capacity of the one or more extensible capacitors.

IPC Classes  ?

  • B60C 19/00 - Tyre parts or constructions not otherwise provided for
  • B60C 23/04 - Signalling devices actuated by tyre pressure mounted on the wheel or tyre
  • B60C 23/06 - Signalling devices actuated by deformation of the tyre
  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
  • G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
  • G01L 1/26 - Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
  • G01M 17/02 - Tyres
  • B60C 23/00 - Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
  • B60C 23/02 - Signalling devices actuated by tyre pressure
  • B29D 30/00 - Producing pneumatic or solid tyres or parts thereof
  • G01B 5/00 - Measuring arrangements characterised by the use of mechanical techniques
  • G01L 1/00 - Measuring force or stress, in general
  • G01M 17/00 - Testing of vehicles
  • G01M 17/007 - Wheeled or endless-tracked vehicles

64.

THERMAL INSULATION MATERIAL

      
Application Number JP2024000438
Publication Number 2024/154644
Status In Force
Filing Date 2024-01-11
Publication Date 2024-07-25
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ui, Takehiro
  • Sasaki, Shu
  • Fuke, Kazuhiro

Abstract

Disclosed is a thermal insulation material which comprises: a flat plate-like thermal insulation member which contains inorganic particles and has a thickness of 0.5 mm to 10 mm; and a plate-like buffering member which contains a fiber-reinforced plastic (FRP) and has a thickness of more than 0 mm but not more than 3 mm, while having a plurality of projected parts that are formed by bending the buffering member itself so as to protrude by a specific height in the stacking direction in which the buffering member and the thermal insulation member are stacked upon each other. Consequently, this thermal insulation material has excellent thermal insulation properties and excellent buffering properties.

IPC Classes  ?

  • F16L 59/02 - Shape or form of insulating materials, with or without coverings integral with the insulating materials
  • H01M 50/291 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
  • H01M 50/293 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material

65.

NUCLEOSIDE PHOSPHORAMIDITE IDENTIFYING SYSTEM, NUCLEOSIDE PHOSPHORAMIDITE IDENTIFYING METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM STORING PROGRAM

      
Application Number 18275076
Status Pending
Filing Date 2023-04-10
First Publication Date 2024-07-18
Owner Nitto Denko Corporation (Japan)
Inventor
  • Yoshida, Kei
  • Kigawa, Yoichi
  • Sugiura, Shinsuke
  • Maeta, Eri
  • Matsunami, Jun

Abstract

A nucleoside phosphoramidite identifying system for improving a nucleoside phosphoramidite identification accuracy includes a memory unit configured to store spectra of solutions of a plurality of different nucleoside phosphoramidites, a detecting unit configured to detect a spectrum of a solution of a nucleoside phosphoramidite, and an identifying unit configured to identify the nucleoside phosphoramidite based on cosine similarity between the spectra stored in the memory unit and the spectrum detected by the detecting unit.

IPC Classes  ?

  • G16B 40/10 - Signal processing, e.g. from mass spectrometry [MS] or from PCR
  • G01N 21/3577 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing liquids, e.g. polluted water
  • G01N 21/65 - Raman scattering
  • G16B 50/30 - Data warehousing; Computing architectures

66.

VACUUM HEAT INSULATION MATERIAL HAVING LIGHT EMITTING ELEMENT, COOLER CONTAINER, METHOD FOR INSPECTING VACUUM HEAT INSULATION MATERIAL HAVING LIGHT EMITTING ELEMENT, AND METHOD FOR MANUFACTURING VACUUM HEAT INSULATION MATERIAL HAVING LIGHT EMITTING ELEMENT

      
Application Number JP2023045240
Publication Number 2024/150608
Status In Force
Filing Date 2023-12-18
Publication Date 2024-07-18
Owner NITTO DENKO CORPORATION (Japan)
Inventor Suzuki, Kazuaki

Abstract

A vacuum heat insulation material 1 having a light emitting element comprises: a heat insulation material 2; a packaging material 3 that is at least partially transparent, and vacuum-packages the heat insulation material 2; a thread-like thermoelectric conversion member 4 that is disposed inside the packaging material 3, and generates electromotive force due to a temperature difference in a thickness direction of the heat insulation material 2; and an LED 53 that is disposed inside the packaging material 3, and emits light due to the electromotive force of the thermoelectric conversion member 4.

IPC Classes  ?

  • F16L 59/065 - Arrangements using an air layer or vacuum using vacuum

67.

ASSEMBLY SHEET

      
Application Number 18404458
Status Pending
Filing Date 2024-01-04
First Publication Date 2024-07-18
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Watanabe, Chihiro
  • Takimoto, Kenya

Abstract

An assembly sheet includes a supporting portion, a plurality of wiring circuit boards, and a joint portion. The supporting portion supports the plurality of wiring circuit boards. The supporting portion surrounds the plurality of wiring circuit boards while being separated from the plurality of wiring circuit boards by an interval. The joint portion joins the plurality of wiring circuit boards to the supporting portion. The plurality of wiring circuit boards includes a first wiring circuit board and a second wiring circuit board. The second wiring circuit board is arranged next to the first wiring circuit board while being separated from the first wiring circuit board by an interval. The second wiring circuit board is symmetrical to the first wiring circuit board with respect to a point centered therebetween. The supporting portion includes a first and second mark. The second mark is asymmetrical to the first with respect to the point.

IPC Classes  ?

  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H05K 1/02 - Printed circuits - Details

68.

WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET

      
Application Number 18559498
Status Pending
Filing Date 2022-01-28
First Publication Date 2024-07-18
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takimoto, Kenya
  • Shibata, Naoki
  • Takakura, Hayato

Abstract

A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.

IPC Classes  ?

69.

SURFACE-MODIFYING LAYER, SURFACE-MODIFYING SHEET, LAMINATE, SURFACE-MODIFIED MEMBER, COATED ARTICLE, METHOD FOR PRODUCING SURFACE-MODIFIED MEMBER, AND METHOD FOR PRODUCING COATED ARTICLE

      
Application Number 18284572
Status Pending
Filing Date 2022-03-25
First Publication Date 2024-07-11
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Nakao, Eriko
  • Ishiguro, Shigeki
  • Takahashi, Tomokazu
  • Oban, Ryohei
  • Endo, Asuka
  • Shimokawa, Kayo

Abstract

The present invention relates to a surface-modifying layer including a polymeric component having a hydroxyl group and an unsaturated hydrocarbon group, in which a molar ratio of the unsaturated hydrocarbon group to the hydroxyl group is 0.01 or more and less than 1, a surface-modifying sheet including the surface-modifying layer and a release sheet, a laminate, a surface-modified member and a coated article, in which the surface-modifying sheet is used, a method for producing a surface-modified member, and a method for producing a coated article.

IPC Classes  ?

  • C09J 175/14 - Polyurethanes having carbon-to-carbon unsaturated bonds
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
  • B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08G 18/62 - Polymers of compounds having carbon-to-carbon double bonds
  • C08G 18/81 - Unsaturated isocyanates or isothiocyanates
  • C08J 7/04 - Coating
  • C08J 7/043 - Improving the adhesiveness of the coatings per se, e.g. forming primers
  • C09J 7/40 - Adhesives in the form of films or foils characterised by release liners

70.

LIGHT GUIDE MEMBER FOR LIGHT EMISSION DEVICE AND LIGHT EMISSION DEVICE

      
Application Number 18288433
Status Pending
Filing Date 2022-06-16
First Publication Date 2024-07-11
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Weng, Yufeng
  • Nakamura, Kozo
  • Yoshikawa, Takahiro

Abstract

A lightguide component for light emission devices has a first principal face and a second principal face at an opposite side from the first principal face. The lightguide component for light emission devices includes: a lightguide layer including a light-receiving portion to receive light emitted from a light source, a third principal face at the first principal face side, and a fourth principal face at the second principal face side; and a light distribution controlling structure having a plurality of internal spaces, the plurality of internal spaces creating interfaces to direct a portion of the light propagating in the lightguide layer toward the first principal face via total internal reflection. In a plan view a first region in which the light distribution controlling structure is present and a second region in which the light distribution controlling structure is not present are disposed so as to define a predetermined design.

IPC Classes  ?

  • F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

71.

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

      
Application Number 18557010
Status Pending
Filing Date 2022-01-26
First Publication Date 2024-07-11
Owner NITTO DENKO CORPORATION (Japan)
Inventor Tsunekawa, Makoto

Abstract

An assembly sheet includes a plurality of wiring circuit boards, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer disposed on a one-surface of the support layer in a thickness direction, and a conductive pattern disposed on a one-surface of the base insulating layer in the thickness direction. The frame supports the wiring circuit board. The reinforcement portion reinforces the frame. The reinforcement portion is disposed on an other-surface of the frame in the thickness direction.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 3/24 - Reinforcing of the conductive pattern

72.

THREE-DIMENSIONAL MOLDED BODY DERIVED FROM TRANSPARENT CONDUCTIVE FILM

      
Application Number JP2023044346
Publication Number 2024/147261
Status In Force
Filing Date 2023-12-12
Publication Date 2024-07-11
Owner NITTO DENKO CORPORATION (Japan)
Inventor Nagase Junichi

Abstract

Provided is a three-dimensional molded body derived from a transparent conductive film. The three-dimensional molded body has excellent conductivity and an excellent appearance despite being derived from a film. This three-dimensional molded body derived from a transparent conductive film comprises a base material and a transparent conductive layer that is provided on at least one side of the base material. The base material includes a resin A that has a softening point of no more than 200°C, and the transparent conductive layer includes metal nanowires. In one embodiment, the metal nanowires have a fused network structure.

IPC Classes  ?

  • B32B 7/025 - Electric or magnetic properties
  • B32B 1/00 - Layered products essentially having a general shape other than plane
  • B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
  • B32B 7/023 - Optical properties
  • G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
  • H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
  • H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

73.

MASKING TAPE FOR FORMING ELECTROMAGNETIC WAVE SHIELD

      
Application Number 18606008
Status Pending
Filing Date 2024-03-15
First Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor Okawa, Yuji

Abstract

Provided is a masking tape to be used at the time of formation of an electromagnetic wave shield, which is excellent in followability to irregularities, and which is capable of being peeled off from an irregular surface without any adhesive residue. The masking tape for forming an electromagnetic wave shield includes a pressure-sensitive adhesive layer that is increased in modulus of elasticity through active energy ray irradiation to 20 times or more as high as that before the active energy ray irradiation, wherein the pressure-sensitive adhesive layer has a modulus of elasticity after the active energy ray irradiation of 500 MPa or less.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C08G 18/62 - Polymers of compounds having carbon-to-carbon double bonds
  • C08G 18/81 - Unsaturated isocyanates or isothiocyanates
  • C09J 133/02 - Homopolymers or copolymers of acids; Metal or ammonium salts thereof
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
  • H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

74.

POLYMER DISPERSED LIQUID CRYSTAL FILM AND MANUFACTURING METHOD THEREFOR

      
Application Number 18283921
Status Pending
Filing Date 2022-03-25
First Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takemoto, Hiroyuki
  • Otsuka, Masanori
  • Kaneko, Keita
  • Shibuya, Akihiro
  • Hirai, Mariko

Abstract

A polymer dispersed liquid crystal (PDLC) film achieves a haze (light diffusibility) capable of exhibiting a shielding function, and improved backscattering ratio. The PDLC film according to an embodiment of the present invention includes a first transparent conductive film, a polymer dispersed liquid crystal layer, and a second transparent conductive film in the stated order. The polymer dispersed liquid crystal layer contains a polymer matrix and droplets of a liquid crystal compound dispersed in the polymer matrix. An average particle diameter of the droplets when viewed from a direction perpendicular to a main surface of the PDLC film is from 0.3 μm to 0.9 μm. A volume ratio of the droplets in the polymer dispersed liquid crystal layer is from 20% to 70%. The liquid crystal compound has a birefringence of from 0.20 to 0.50. The polymer dispersed liquid crystal layer has a thickness of from 5 μm to 40 μm.

IPC Classes  ?

  • G02F 1/1334 - Constructional arrangements based on polymer-dispersed liquid crystals, e.g. microencapsulated liquid crystals

75.

METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD

      
Application Number JP2023019315
Publication Number 2024/142428
Status In Force
Filing Date 2023-05-24
Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kouchi Takaya
  • Niino Teppei
  • Kobayashi Kentaro

Abstract

This wiring circuit board manufacturing method includes: a first step in which a waste liquid of a wiring-circuit formation processing liquid, which was used in a wiring-circuit forming step, is subjected to membrane processing to obtain a membrane penetrating liquid containing a component of the processing liquid; a second step in which a reuse wiring-circuit formation processing liquid is prepared using the membrane penetrating liquid; and a third step in which a wiring circuit is formed using the reuse wiring-circuit formation processing liquid.

IPC Classes  ?

  • G03F 7/32 - Liquid compositions therefor, e.g. developers
  • H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
  • H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

76.

WATERPROOF MEMBER, WATERPROOF CASE, AND ELECTRONIC APPARATUS

      
Application Number JP2023044746
Publication Number 2024/142950
Status In Force
Filing Date 2023-12-13
Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yamamoto Hajime
  • Fukushima Tamao

Abstract

The present invention provides a waterproof member that is suitable for achieving both waterproofing properties and sound-conducting characteristics, a waterproof case provided with the same, and an electronic apparatus. The waterproof member comprises a waterproof membrane. The storage elastic modulus E' of the waterproof membrane in a frequency range of 100-500 Hz as measured using a dynamic viscoelasticity measurement test in a tensile mode is 2.5×106Pa to 7.5×106 Pa, and the waterproof membrane satisfies at least one selected from (i) and (ii) below. (i) The initial elastic modulus as measured using a tensile test is 30-100 MPa. (ii) The piercing elastic modulus, which is measured in conformity with a piercing strength test under JIS Z1707:2019 and calculated by dividing a maximum stress until a needle penetrates the waterproof film by the amount of piercing-direction displacement of the waterproof film at the time the maximum stress is reached, is 9.0-40 MPa.

IPC Classes  ?

  • H04R 1/00 - LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS - Details of transducers
  • H05K 5/06 - Hermetically-sealed casings

77.

METHOD FOR MANUFACTURING ELECTRICAL ELEMENT MOUNTING BOARD, ELECTRICAL ELEMENT MOUNTING BOARD, AND ELECTRONIC DEVICE

      
Application Number JP2023046670
Publication Number 2024/143364
Status In Force
Filing Date 2023-12-26
Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ishii, Jun
  • Fujibayashi, Yukihiro

Abstract

Manufactured is an electrical element mounting board in which an electrical element is mounted on a wiring circuit board. The wiring circuit board includes a plurality of insulation layers formed by stacking, and a plurality of conductor layers respectively formed on the plurality of insulation layers. In this method for manufacturing an electrical element mounting board, a metal support is prepared, and the wiring circuit board is produced on the prepared metal support. The electrical element is mounted on the produced wiring circuit board. The metal support is removed from the wiring circuit board after the wiring circuit board is produced and before the step for mounting the electrical element on the wiring circuit board.

IPC Classes  ?

  • H05K 3/46 - Manufacturing multi-layer circuits
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

78.

SURFACE-MODIFYING SHEET, LAMINATE, SURFACE-MODIFIED MEMBER, COATED ARTICLE, METHOD FOR PRODUCING SURFACE-MODIFIED MEMBER, AND METHOD FOR PRODUCING COATED ARTICLE

      
Application Number 18283899
Status Pending
Filing Date 2022-03-14
First Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Oban, Ryohei
  • Shimokawa, Kayo
  • Endo, Asuka
  • Ishiguro, Shigeki
  • Nakao, Eriko

Abstract

The present invention relates to a surface-modifying sheet including a release sheet and a surface-modifying layer, in which the surface-modifying layer contains a polymeric component and an oligomer component, the oligomer component has a weight average molecular weight (Mw) of 100 to 7,000, a HSP distance (Ra) between the oligomer component and a bisphenol A type glycidyl ether is 7.5 or more, and the oligomer component is contained in an amount of 0.1 to 30 parts by mass with respect to 100 parts by mass of the polymeric component, and relates to a laminate, a surface-modified member and a coated article using the surface-modifying sheet, a method for producing the surface-modified member, and a method for producing the coated article.

IPC Classes  ?

  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
  • B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
  • B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
  • B32B 37/26 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the laminating process, e.g. release layers or pressure equalising layers

79.

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

      
Application Number 18550252
Status Pending
Filing Date 2022-01-25
First Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takakura, Hayato
  • Shibata, Naoki
  • Tsunekawa, Makoto

Abstract

A method for producing a wiring circuit board includes a step of forming an insulating layer on one surface in a thickness direction of a substrate, a step of forming a plurality of wirings on one surface in the thickness direction of the insulating layer, a step of forming an opening portion including the plurality of wirings when projected in the thickness direction in the substrate, a step of forming a resist pattern having an opening portion having a pattern shape along the plurality of wirings on the other surface in the thickness direction of the insulating layer, a step of forming a metal support portion by depositing a metal material on the insulating layer inside the opening portion, and a step of removing the resist pattern.

IPC Classes  ?

  • H05K 3/46 - Manufacturing multi-layer circuits

80.

LIGHT GUIDE MEMBER FOR LIGHTING DEVICE AND LIGHTING DEVICE

      
Application Number 18570874
Status Pending
Filing Date 2022-06-10
First Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Mukadeyama, Shimpei
  • Yoshikawa, Takahiro
  • Nakamura, Kozo

Abstract

A lightguide component for illumination devices having an exit surface includes: a lightguide layer having a light-receiving portion to receive light emitted from a light source, a first principal face at the exit surface side, and a second principal face at an opposite side from the first principal face; a light distribution controlling structure having a plurality of internal spaces, each of the plurality of internal spaces including a first slope to direct a portion of light propagating in the lightguide layer toward the exit surface via total internal reflection, and a second slope at an opposite side from the first slope, wherein, when viewed from a normal direction of the first principal face of the lightguide layer, the first slope presents a curved surface that is convex toward the light source; and an anti-reflection layer and/or anti-glare layer disposed at the first principal face side of the lightguide layer.

IPC Classes  ?

  • F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

81.

ELECTRICAL DEBONDING ADHESIVE SHEET, JOINED BODY, AND JOINING AND SEPARATION METHOD FOR ADHEREND

      
Application Number 18610364
Status Pending
Filing Date 2024-03-20
First Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Akamatsu, Kaori
  • Mizobata, Kaori
  • Awane, Ryo
  • Hirao, Akira
  • Yokoyama, Junji
  • Shimizu, Yosuke

Abstract

The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.

IPC Classes  ?

  • B32B 7/06 - Interconnection of layers permitting easy separation
  • B32B 3/04 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by a layer folded at the edge, e.g. over another layer
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor

82.

WATERPROOF MEMBER AND WATERPROOF CASE

      
Application Number JP2023044747
Publication Number 2024/142951
Status In Force
Filing Date 2023-12-13
Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yamamoto Hajime
  • Fukushima Tamao

Abstract

The present invention provides a waterproof member that is suitable for suppressing continuous deformation of a waterproof membrane caused by the water pressure applied, and a waterproof case comprising the same. A waterproof member 10 is disposed in such a manner as to close an opening 51 of an object 50 that has an open surface 51s having the opening 51 formed therein. The waterproof member 10 has a waterproof membrane 1 that has a first main surface 1a opposing the opening 51 when the waterproof 10 is disposed to close the opening 51. The waterproof member 10 has a function of suppressing the adherence of the waterproof membrane 1 to a surface opposing the first main surface 1a.

IPC Classes  ?

  • H04R 1/00 - LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS - Details of transducers
  • B01D 71/36 - Polytetrafluoroethene
  • H04M 1/02 - Constructional features of telephone sets

83.

SEAL MATERIAL

      
Application Number JP2023045385
Publication Number 2024/143054
Status In Force
Filing Date 2023-12-18
Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kamaya Yusuke
  • Ukei Hiroichi
  • Suzuki Hideyuki
  • Iwase Takayuki

Abstract

ABA1A1BB is a 90° peel adhesive force [N/20 mm] that is measured for the peeling of a test piece produced from the seal material 1a from a test panel in conformance with the JIS Z 0237:2022 standard after the environmental temperature for the test piece was maintained at 100°C for seven days while the test piece was adhered to the test panel.

IPC Classes  ?

  • C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 11/04 - Non-macromolecular additives inorganic
  • C09J 201/00 - Adhesives based on unspecified macromolecular compounds

84.

ADHESIVE SHEET

      
Application Number JP2023045386
Publication Number 2024/143055
Status In Force
Filing Date 2023-12-18
Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kamaya Yusuke
  • Ukei Hiroichi
  • Suzuki Hideyuki
  • Iwase Takayuki

Abstract

ETABCBB is a 90° peeling-off adhesion force [N/20 mm] that is measured after the retention of an environment temperature for a test specimen produced from the adhesive sheet 1a at 100°C for 7 days while the test specimen being adhered onto a test plate.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 7/26 - Porous or cellular plastics
  • C09J 153/02 - Vinyl aromatic monomers and conjugated dienes

85.

WIRING CIRCUIT BOARD, ELECTRICAL ELEMENT MOUNTING BOARD, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTRICAL ELEMENT MOUNTING BOARD

      
Application Number JP2023047178
Publication Number 2024/143520
Status In Force
Filing Date 2023-12-28
Publication Date 2024-07-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ishii, Jun
  • Fujibayashi, Yukihiro
  • Enoki, Masato

Abstract

This wiring circuit board has a first surface and a second surface facing in mutually opposite directions in the thickness direction. This wiring circuit board comprises a plurality of stacked insulation layers, a plurality of conductor layers formed on any of the insulation layers, and a plurality of terminal units. The plurality of terminal units are formed on a first surface, and the plurality of terminal units are formed on a second surface. A first conductor layer is formed on one first insulation layer among the plurality of insulation layers. The total of the thickness of the first insulation layer and the thickness of the first conductor layer is 30 µm or less.

IPC Classes  ?

  • H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
  • H05K 3/46 - Manufacturing multi-layer circuits

86.

PLASTIC OPTICAL FIBER, HYBRID CABLE, PATCH CORD, AND ACTIVE OPTICAL CABLE

      
Application Number 18553090
Status Pending
Filing Date 2022-03-29
First Publication Date 2024-06-27
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Shimizu, Takashi
  • Ohmura, Hiroshi
  • Saito, Takeshi

Abstract

A plastic optical fiber includes a core and a clad disposed on an outer circumference of the core. The core includes a first resin, and the clad includes a second resin. The first resin has a first glass transition temperature Tg1 of 120° C. or higher. The second resin has a second glass transition temperature Tg2 of 120° C. or higher. When the plastic optical fiber bent once 180 degrees at 25° C. has a curvature radius R and a minimum of the curvature radius R is defined as a curvature radius at which a crack does not occur in a bent portion of the plastic optical fiber, the minimum is 5 mm or less.

IPC Classes  ?

  • G02B 6/02 - Optical fibres with cladding
  • B29D 11/00 - Producing optical elements, e.g. lenses or prisms
  • G02B 6/44 - Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables

87.

PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number 18279565
Status Pending
Filing Date 2022-02-28
First Publication Date 2024-06-27
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ogino, Yoshiko
  • Kumada, Tatsuya
  • Hara, Yusuke
  • Naito, Tomonari

Abstract

An adhesive composition contains a β-1,3-glucan derivative having a degree of substitution of the acyl group of 2.6 or more and less than 3.0, and an isocyanate-based crosslinking agent. A pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer formed from the adhesive composition.

IPC Classes  ?

  • C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

88.

OPTICAL TRANSMITTER, OPTICAL TRANSMITTER ARRAY, OPTICAL TRANSMISSION APPARATUS, AND OPTICAL COMMUNICATION SYSTEM

      
Application Number 18390980
Status Pending
Filing Date 2023-12-20
First Publication Date 2024-06-27
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tanaka, Takeshi
  • Tsujita, Yuichi

Abstract

An optical transmitter includes a TOSA and an LC parallel circuit. The TOSA is configured to convert a first electrical signal into an optical signal. The LC parallel circuit includes an inductor and a capacitor. The inductor and the capacitor are connected in parallel to each other. The LC parallel circuit is connected to the TOSA.

IPC Classes  ?

  • H04B 10/50 - Transmitters
  • H04B 10/2575 - Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier

89.

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

      
Application Number 18557020
Status Pending
Filing Date 2022-01-26
First Publication Date 2024-06-27
Owner NITTO DENKO CORPORATION (Japan)
Inventor Tsunekawa, Makoto

Abstract

An assembly sheet includes a wiring circuit board, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer, and a conductive pattern. The frame supports the wiring circuit board. The reinforcement portion is disposed on the frame and reinforces the frame. The reinforcement portion has a first layer made of a metal and a second layer made of a metal.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 1/05 - Insulated metal substrate
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

90.

MULTILAYER SHEET, AND METHOD FOR MANUFACTURING MULTILAYER SHEET

      
Application Number JP2023044400
Publication Number 2024/135450
Status In Force
Filing Date 2023-12-12
Publication Date 2024-06-27
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tanaka, Yukiko
  • Kimura, Ryuichi
  • Ikeda, Jun

Abstract

Provided is a multilayer sheet that achieves high visibility and easy alignment during production processes while ultimately exhibiting light diffusing properties. The multilayer sheet has a sheet releasably laminated on at least one main surface of a curable resin layer, wherein a surface of the sheet in contact with the curable resin layer has higher surface roughness than the non-contact surface-side of the sheet, and the in-line transmittance ratio expressed by the following expression is at least 2. (in-line transmittance of multilayer sheet at 800 nm before release/in-line transmittance of multilayer sheet at 800 nm after release of sheet having high surface roughness)

IPC Classes  ?

  • G02B 5/02 - Diffusing elements; Afocal elements
  • B32B 7/023 - Optical properties
  • B32B 7/06 - Interconnection of layers permitting easy separation

91.

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

      
Application Number 18532910
Status Pending
Filing Date 2023-12-07
First Publication Date 2024-06-20
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ikeda, Takahiro
  • Niino, Teppei
  • Shibata, Shusaku
  • Tetsukawa, Shoei

Abstract

A method for producing a wiring circuit board includes a step (1) of producing a substrate with a metal support board including a metal support board and a step (2) of etching the metal support board. The wiring circuit board includes a frame, a mounting portion, an opening portion, and a joint. Each of the frame and the mounting portion includes a metal support layer, a base insulating layer, a conductive layer, and a cover insulating layer. The joint does not include the metal support layer. In step (2), by etching the metal support board corresponding to the opening portion and the joint from the other side in the thickness direction by using an etching resist, the metal support layer is formed.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

92.

CAPACITIVE SEAT SENSOR AND METHODS FOR MAKING AND USING SAME

      
Application Number 18555499
Status Pending
Filing Date 2022-04-13
First Publication Date 2024-06-20
Owner
  • NITTO, INC. (USA)
  • NITTO DENKO CORPORATION (Japan)
Inventor
  • Omote, Toshihiko
  • Delos Santos, Benedicto
  • Belknap, Juma
  • Bortell, John
  • Ottley, Colton Allen
  • Jonas, Jared K.
  • Eichinger, Colin D.
  • Briggs, Nathan C.

Abstract

In an example, a vehicle seat sensor system includes a vehicle seat, a flexible seat sensor, and an electronics unit. The vehicle seat includes a seat surface. The flexible seat sensor is disposed within a deformable distance from the seat surface and includes one or more signal electrodes, one or more ground electrodes, one or more dielectric layers, and one or more capacitors. Each capacitor is formed by a combination of a corresponding signal electrode and a corresponding ground electrode with a corresponding dielectric layer positioned between the corresponding signal electrode and the corresponding ground electrode. The electronics unit is connected to the flexible seat sensor and is configured to electrically communicate with the flexible seat sensor. The flexible seat sensor is configured to provide a capacitive output proportional to an amount of pressure applied to the flexible seat sensor.

IPC Classes  ?

  • B60R 21/015 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents including means for detecting the presence or position of passengers, passenger seats or child seats, e.g. for disabling triggering
  • G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators

93.

OPTICAL LAMINATE, METHOD FOR PRODUCING OPTICAL LAMINATE, OPTICAL MEMBER, OPTICAL APPRATUS, METHOD FOR PRODUCING OPTICAL MEMBER, AND METHOD FOR PRODUCING OPTICAL APPARATUS

      
Application Number 18285069
Status Pending
Filing Date 2021-12-28
First Publication Date 2024-06-20
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Morishima, Ryota
  • Hattori, Daisuke
  • Yoshikawa, Takahiro

Abstract

The present invention provides an optical laminate including a void-containing layer in which a pressure-sensitive adhesive, an adhesive, and the like barely permeate a void. In order to achieve the object, an optical laminate (10a) or (10b) of the present invention includes a void-containing layer (12) and a low moisture permeable layer (13) formed on the void-containing layer (12), wherein the low moisture permeable layer (13) includes at least one element selected from the group consisting of metal, metal oxide, silicon, silicon oxide and an organic-inorganic hybrid material, and a moisture vapor transmission rate of the low moisture permeable layer (13) measured by a dish method defined in JIS Z 0208-1976 is 35 g/m2·day or less.

IPC Classes  ?

94.

LOW-DIELECTRIC BOARD MATERIAL

      
Application Number 18287344
Status Pending
Filing Date 2022-04-14
First Publication Date 2024-06-20
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Imaizumi, Taku
  • Matsutomi, Akihito
  • Nagami, Naoto

Abstract

A low-dielectric board material includes a metal layer and a porous resin layer disposed on a one-side surface of the metal layer in the thickness direction. The porous resin layer includes a first region, a second region, a third region, and a fourth region that are located in sequence toward a direction away from the metal layer when the porous resin layer is equally divided into four in the thickness direction. The first region has a plurality of closed cells that are separate from each other in a resin matrix. The average of the aspect ratios AR of the plurality of closed cells in the first region is 0.80 or more and 1.20 or less. The average of the aspect ratios AR is a ratio (L1/L2) of a length L1 of a closed cell in a direction orthogonal to the thickness direction to a length L2 of the closed cell in the thickness direction in a cross-sectional view.

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • C09D 7/65 - Additives macromolecular
  • C09D 179/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

95.

SWITCH DEVICE

      
Application Number 18287099
Status Pending
Filing Date 2022-04-18
First Publication Date 2024-06-20
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Murashige, Takeshi
  • Hino, Takafumi
  • Kishi, Atsushi

Abstract

A present switch device includes a glass layer, and a switch section situated on a back surface side of the glass layer. A thickness of the glass layer is 20 μm or greater and 150 μm or less. The switch section includes a plurality of contact points including a vertically movable contact point. When the glass layer is pushed, the glass layer elastically deforms and the plurality of contact points switch between a continuous state and a non-continuous state.

IPC Classes  ?

96.

METHOD FOR PRESERVING COMPOSITE SEMIPERMEABLE MEMBRANE, PRESERVATION SOLUTION, AND SPIRAL MEMBRANE ELEMENT

      
Application Number 18501376
Status Pending
Filing Date 2023-11-03
First Publication Date 2024-06-20
Owner NITTO DENKO CORPORATION (Japan)
Inventor Okazaki, Yuha

Abstract

Provided are a method for preserving a composite semipermeable membrane which is less likely to cause a decrease in the water permeability of the composite semipermeable membrane even in a high-temperature environment, a preservation solution used for the method, and a spiral membrane element including the preservation solution. A method for preserving a composite semipermeable membrane that allows monovalent ions to selectively permeate therethrough, the method includes using an aqueous solution containing an inorganic salt and/or an organic salt composed only of monovalent cations and monovalent anions as a preservation solution to be brought into contact with the composite semipermeable membrane.

IPC Classes  ?

  • B01D 65/06 - Membrane cleaning or sterilisation with special washing compositions
  • B01D 61/10 - Accessories; Auxiliary operations
  • B01D 63/10 - Spiral-wound membrane modules
  • B01D 67/00 - Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
  • B01D 69/12 - Composite membranes; Ultra-thin membranes
  • B01D 71/56 - Polyamides, e.g. polyester-amides

97.

WIRING CIRCUIT BOARD

      
Application Number 18532897
Status Pending
Filing Date 2023-12-07
First Publication Date 2024-06-20
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ikeda, Takahiro
  • Niino, Teppei

Abstract

A wiring circuit board includes a metal supporting layer, an adhesion layer, a first conductive layer, an insulating layer, and a second conductive layer. The adhesion layer is disposed on one-side surface of the metal supporting layer in the thickness direction, and contains at least one metal selected from the group Zr, Ti, W, Mo, V, Y, Nb, and Ta. The first conductive layer is disposed on one-side surface of the adhesion layer in the thickness direction, and has an insulating layer with a penetrating hole disposed on a one-side surface thereof. The second conductive layer includes a portion electrically connected with the metal supporting layer through the adhesion layer located in the penetrating hole. The second conductive layer is located at one side of the metal supporting layer in the penetrating hole and one side of the insulating layer in the thickness direction.

IPC Classes  ?

  • H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
  • H05K 1/02 - Printed circuits - Details

98.

CURABLE RESIN COMPOSITION, POLARIZING FILM, MULTILAYER OPTICAL FILM, AND IMAGE DISPLAY DEVICE

      
Application Number JP2023030536
Publication Number 2024/127721
Status In Force
Filing Date 2023-08-24
Publication Date 2024-06-20
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kanno,ryo
  • Matsubara,motona
  • Hasegawa,yuki

Abstract

This curable resin composition contains: a component (A) that is at least one type selected from the group consisting of a (meth)acrylic-modified polybutadiene and a (meth)acrylic-modified polyisoprene; and a component (B) comprising a (meth)acrylate monomer. This polarizing film is obtained by layering an optical film on at least one surface of a polarizer via an adhesive layer. The adhesive layer is a layer of a cured product of the curable resin composition.

IPC Classes  ?

99.

CURABLE RESIN COMPOSITION, POLARIZING FILM, MULTILAYER OPTICAL FILM AND IMAGE DISPLAY DEVICE

      
Application Number JP2023030577
Publication Number 2024/127722
Status In Force
Filing Date 2023-08-24
Publication Date 2024-06-20
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kanno,ryo
  • Matsubara,motona
  • Hasegawa,yuki

Abstract

Disclosed is a curable resin composition which contains a component (A) that is composed of a polymer which comprises at least, as a repeating unit, a basic unit that has 5 or more carbon atoms without containing an oxygen atom. It is preferable that this curable resin composition contains a component (B) that is composed of a (meth)acrylate monomer. Also disclosed is a polarizing film which is obtained by disposing an optical film on at least one surface of a polarizer, with an adhesive layer being interposed therebetween, wherein the adhesive layer is a layer of a cured product of the above-described curable resin composition.

IPC Classes  ?

  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • B32B 7/023 - Optical properties
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
  • C08F 257/00 - Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group
  • C09J 4/02 - Acrylmonomers
  • C09J 7/35 - Heat-activated
  • C09J 125/08 - Copolymers of styrene
  • G02B 5/30 - Polarising elements
  • H10K 50/84 - Passivation; Containers; Encapsulations
  • H10K 50/86 - Arrangements for improving contrast, e.g. preventing reflection of ambient light
  • H10K 59/10 - OLED displays

100.

CURABLE COMPOSITION, POLARIZING FILM, OPTICAL FILM, AND IMAGE DISPLAY DEVICE

      
Application Number JP2023031397
Publication Number 2024/127733
Status In Force
Filing Date 2023-08-30
Publication Date 2024-06-20
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Miki,shintaro
  • Kanno,ryo

Abstract

This curable composition contains: a polythiol compound having two or more secondary thiol groups; a curable component; and a radical generator. This polarizing film is obtained by layering an optical film on at least one surface of a polarizer via an adhesive layer. The adhesive layer is a layer of a cured product of the curable composition. If the total amount of the composition is taken to be 100 mass%, the content of the polythiol compound is preferably 0.5-10 mass%. If the total amount of the composition is taken to be 100 mass%, the content of the radical generator is preferably 0.5-5 mass%. If the content of the polythiol compound is taken to be a mass% and the content of the radical generator is taken to be b mass%, the value of a/b is preferably 0.5-10.

IPC Classes  ?

  • C08G 75/045 - Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • C08F 2/46 - Polymerisation initiated by wave energy or particle radiation
  • C09J 4/02 - Acrylmonomers
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
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