2023
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Invention
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Optical sensor package with encapsulant is between and separates substrates and multiple assembli... |
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Invention
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Gas sensor device for detecting gases with large molecules.
The present disclosure is directed t... |
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Invention
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Power package with copper plating and molding structure.
The present disclosure is directed to a... |
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Invention
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Wafer level chip scale package having varying thicknesses.
A wafer level chip scale package (WLC... |
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Invention
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Semiconductor package with gas release holes.
A semiconductor package includes a silicon substra... |
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Invention
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Method for auto-aligned manufacturing of a trench-gate mos transistor, and shielded-gate mos tran... |
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Invention
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Semiconductor device with a dielectric between portions.
A semiconductor device having a channel... |
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Invention
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Multi-chip package.
A multi-chip package including a first integrated circuit and a second integ... |
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Invention
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Semiconductor package with exposed electrical contacts.
A semiconductor package includes a die a... |
2022
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Invention
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Semiconductor metal oxide based gas sensor activated at zero heater power.
A gas sensor is forme... |
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Invention
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Integrated circuit chip package that does not utilize a leadframe.
An integrated circuit die inc... |
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Invention
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Thick bonding pad structure for wire bond stress reduction.
A bonding pad for an integrated circ... |
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Invention
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Molded proximity sensor.
A proximity sensor includes a printed circuit board substrate, a semico... |
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Invention
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Oxide field trench power mosfet with a multi epitaxial layer substrate configuration.
A semicond... |
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Invention
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Sensor package including a sensor die.
The present disclosure is directed to embodiments of sens... |
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Invention
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Sensor package with embedded integrated circuit.
Provided is a sensor package with an integrated... |
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Invention
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Low cost wafer level packages and silicon.
Described herein is a method of forming wafer-level p... |
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Invention
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Crack detection integrity check. A method of testing an integrated circuit die (IC) for cracks in... |
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Invention
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Charge coupled field effect rectifier diode and method of making.
A trench in a semiconductor su... |
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Invention
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Method of manufacturing electronic devices and corresponding electronic device.
A substrate incl... |
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Invention
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Low profile sensor packages.
The present disclosure is directed to embodiments of optical sensor... |
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Invention
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Optical integrated circuit sensor package using a stacked configuration for the sensor die and th... |
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Invention
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Semiconductor device package with conductive vias and method of manufacturing.
The present discl... |
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Invention
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Gate contact structure for a trench power mosfet with a split gate configuration.
An integrated ... |
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Invention
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Wafer level packaging having redistribution layer formed utilizing laser direct structuring.
A m... |
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Invention
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Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an i... |
2021
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Invention
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Sensor die package.
The present disclosure is directed to a package that includes a transparent ... |
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Invention
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Stacked die package including a multi-contact interconnect.
The present disclosure is directed t... |
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Invention
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Proximity sensor with integrated als. A semiconductor package that is a proximity sensor includes... |
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Invention
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Package with polymer pillars and raised portions.
The present disclosure is directed to semicond... |
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Invention
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Passivation layer for an integrated circuit device that provides a moisture and proton barrier.
... |
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Invention
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Optical sensor package and method of making an optical sensor package.
A molded carrier is forme... |
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Invention
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Method for manufacturing a wafer level chip scale package (wlcsp). Trenches are opened from a top... |
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Invention
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Molded range and proximity sensor with optical resin lens. A method for forming a molded proximit... |
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Invention
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Split-gate trench power mosfet with self-aligned poly-to-poly isolation. A semiconductor substrat... |
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Invention
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Wafer level proximity sensor.
Wafer level proximity sensors are formed by processing a silicon s... |
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Invention
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Embedded wafer level optical sensor packaging.
The present disclosure is directed to a sensor di... |
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Invention
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Wafer level chip scale packaging with sensor.
The present disclosure is directed to a package (e... |
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Invention
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Slanted glass edge for image sensor package.
A digital image sensor package includes an image se... |
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Invention
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Power mosfet with reduced current leakage and method of fabricating the power mosfet.
An integra... |
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Invention
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Adaptive test method and designs for low power mox sensor. The present disclosure is directed to ... |
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Invention
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Monolithic charge coupled field effect rectifier embedded in a charge coupled field effect transi... |
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Invention
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Wlcsp with transparent substrate and method of manufacturing the same. The present disclosure is ... |
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Invention
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Gas sensor device for detecting gases with large molecules. The present disclosure is directed to... |
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Invention
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Semiconductor package with protected sidewall and method of forming the same. A semiconductor pac... |
2020
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Invention
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Mems thin membrane with stress structure.
A blind opening is formed in a bottom surface of a sem... |
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Invention
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Wlcsp package with different solder volumes. The present disclosure is directed to a wafer level ... |
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Invention
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Process for integrated circuit fabrication using a buffer layer as a stop for chemical mechanical... |
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Invention
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Package with electrical interconnection bridge. The present disclosure is directed to a package t... |