STMicroelectronics Pte Ltd.

Singapore

 
Total IP 180
Total IP Rank # 6,990
IP Activity Score 2.8/5.0    105
IP Activity Rank # 6,645
Parent Entity STMicroelectronics N.V.

Patents

Trademarks

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Last Patent 2024 - Gas sensor device for detecting ...
First Patent 1994 - Power sharing detector for use w...

Latest Inventions, Goods, Services

2023 Invention Optical sensor package with encapsulant is between and separates substrates and multiple assembli...
Invention Gas sensor device for detecting gases with large molecules. The present disclosure is directed t...
Invention Power package with copper plating and molding structure. The present disclosure is directed to a...
Invention Wafer level chip scale package having varying thicknesses. A wafer level chip scale package (WLC...
Invention Semiconductor package with gas release holes. A semiconductor package includes a silicon substra...
Invention Method for auto-aligned manufacturing of a trench-gate mos transistor, and shielded-gate mos tran...
Invention Semiconductor device with a dielectric between portions. A semiconductor device having a channel...
Invention Multi-chip package. A multi-chip package including a first integrated circuit and a second integ...
Invention Semiconductor package with exposed electrical contacts. A semiconductor package includes a die a...
2022 Invention Semiconductor metal oxide based gas sensor activated at zero heater power. A gas sensor is forme...
Invention Integrated circuit chip package that does not utilize a leadframe. An integrated circuit die inc...
Invention Thick bonding pad structure for wire bond stress reduction. A bonding pad for an integrated circ...
Invention Molded proximity sensor. A proximity sensor includes a printed circuit board substrate, a semico...
Invention Oxide field trench power mosfet with a multi epitaxial layer substrate configuration. A semicond...
Invention Sensor package including a sensor die. The present disclosure is directed to embodiments of sens...
Invention Sensor package with embedded integrated circuit. Provided is a sensor package with an integrated...
Invention Low cost wafer level packages and silicon. Described herein is a method of forming wafer-level p...
Invention Crack detection integrity check. A method of testing an integrated circuit die (IC) for cracks in...
Invention Charge coupled field effect rectifier diode and method of making. A trench in a semiconductor su...
Invention Method of manufacturing electronic devices and corresponding electronic device. A substrate incl...
Invention Low profile sensor packages. The present disclosure is directed to embodiments of optical sensor...
Invention Optical integrated circuit sensor package using a stacked configuration for the sensor die and th...
Invention Semiconductor device package with conductive vias and method of manufacturing. The present discl...
Invention Gate contact structure for a trench power mosfet with a split gate configuration. An integrated ...
Invention Wafer level packaging having redistribution layer formed utilizing laser direct structuring. A m...
Invention Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an i...
2021 Invention Sensor die package. The present disclosure is directed to a package that includes a transparent ...
Invention Stacked die package including a multi-contact interconnect. The present disclosure is directed t...
Invention Proximity sensor with integrated als. A semiconductor package that is a proximity sensor includes...
Invention Package with polymer pillars and raised portions. The present disclosure is directed to semicond...
Invention Passivation layer for an integrated circuit device that provides a moisture and proton barrier. ...
Invention Optical sensor package and method of making an optical sensor package. A molded carrier is forme...
Invention Method for manufacturing a wafer level chip scale package (wlcsp). Trenches are opened from a top...
Invention Molded range and proximity sensor with optical resin lens. A method for forming a molded proximit...
Invention Split-gate trench power mosfet with self-aligned poly-to-poly isolation. A semiconductor substrat...
Invention Wafer level proximity sensor. Wafer level proximity sensors are formed by processing a silicon s...
Invention Embedded wafer level optical sensor packaging. The present disclosure is directed to a sensor di...
Invention Wafer level chip scale packaging with sensor. The present disclosure is directed to a package (e...
Invention Slanted glass edge for image sensor package. A digital image sensor package includes an image se...
Invention Power mosfet with reduced current leakage and method of fabricating the power mosfet. An integra...
Invention Adaptive test method and designs for low power mox sensor. The present disclosure is directed to ...
Invention Monolithic charge coupled field effect rectifier embedded in a charge coupled field effect transi...
Invention Wlcsp with transparent substrate and method of manufacturing the same. The present disclosure is ...
Invention Gas sensor device for detecting gases with large molecules. The present disclosure is directed to...
Invention Semiconductor package with protected sidewall and method of forming the same. A semiconductor pac...
2020 Invention Mems thin membrane with stress structure. A blind opening is formed in a bottom surface of a sem...
Invention Wlcsp package with different solder volumes. The present disclosure is directed to a wafer level ...
Invention Process for integrated circuit fabrication using a buffer layer as a stop for chemical mechanical...
Invention Package with electrical interconnection bridge. The present disclosure is directed to a package t...