2023
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Invention
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Component carrier with an embedded thermally conductive block and manufacturing method.
A compon... |
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Invention
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Electronic package comprising a decoupling layer structure.
An electronic package having a base ... |
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Invention
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Separating a foreign metal from a process fluid, method and apparatus. There is described a metho... |
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Invention
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Component carrier having dielectric layer with conductively filled through holes tapering in oppo... |
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Invention
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Method of processing a process fluid in component carrier manufacture. There is described a metho... |
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Invention
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Component with dielectric layer for embedding in component carrier.
A component carrier includes... |
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Invention
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Component carrier with signal conductive element and shielding conductive structure. A carrier as... |
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Invention
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Dielectric element in component carrier embedded waveguide. There is described a component carrie... |
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Invention
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Component carrier with stamped design layer structure and embedded component. A component carrier... |
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Invention
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Package having component carrier and embedded optical and electric chips with horizontal signal p... |
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Invention
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Device and method for identifying a foreign material. The disclosure relates to a device and a co... |
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Invention
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Component carrier and method of manufacturing the same.
A component carrier includes a laminated... |
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Invention
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Package and its manufacturing method. The present application provides a package (100) and its ma... |
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Invention
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Package with component carrier, interposer and component and method of manufacturing the same. Th... |
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Invention
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Component carrier with embedded magnetic inlay and integrated coil structure.
A component carrie... |
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Invention
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Component carrier with embedded electronic switch components and a capacitor device. It is descri... |
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Invention
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A package and a method of manufacturing a package. A package (100) which comprises an inorganic c... |
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Invention
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Method for estimating a conversion degree value of a conversion degree of a polymeric material, a... |
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Invention
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Rf front-end functionality integrated in a component carrier stack. There is described a radio fr... |
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Invention
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Component carrier with protruding dielectric signal element, and manufacture method. There is des... |
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Invention
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Ic substrate with support structure and functional inlays therein. An integrated circuit substrat... |
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Invention
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Ic substrate having central section with vertically stacked functional volume sections. An integr... |
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Invention
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Package with ic substrate and electronic component connected with direct physical contact. A pack... |
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Invention
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Component carrier and method of manufacturing the same. The present invention provides a componen... |
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Invention
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Component carrier with rough surface and smooth surface metal traces, and manufacture method. It ... |
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Invention
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Cavity formation using depth routing, component carrier and component carrier assembly. There is ... |
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Invention
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Manufacturing a component carrier using a protection layer. It is described a method of manufactu... |
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Invention
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Component carrier and method of manufacturing the same.
A component carrier includes a stack hav... |
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Invention
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Metal body formed on a component carrier by additive manufacturing.
A component carrier includes... |
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Invention
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Inlay with exposed porous layer, component carrier and manufacturing methods.
An inlay for a com... |
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Invention
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Carrier assembly and method for producing a carrier assembly.
Described herein is a component ca... |
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Invention
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Component carrier.
Described herein are a component carrier, wherein the component carrier compr... |
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Invention
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Interconnection of printed circuit boards with nanowires.
A carrier assembly may include a first... |
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Invention
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Inductor inlay for a component carrier and a method of manufacturing the same.
An inductor inlay... |
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Invention
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Module comprising a semiconductor-based component and method of manufacturing the same.
A module... |
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Invention
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Package with organic integrated circuit substrate embedded in inorganic carrier body and redistri... |
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Invention
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Component carrier with embedded ic substrate inlay, and manufacturing method.
A component carrie... |
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Invention
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Component carrier with protruding portions and manufacturing method.
A coreless component carrie... |
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Invention
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Component carrier with connected component having redistribution layer at main surface.
A compon... |
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Invention
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Antenna layer structures separated by fluid-filled cavity, an antenna inlay, and a component carr... |
2022
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G/S
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Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or co... |
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Invention
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Method of manufacturing a component carrier metal trace and a component carrier.
A method for ma... |
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Invention
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Method for making contact with a component embedded in a printed circuit board.
The invention pe... |
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Invention
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Component carrier with a via containing a hardened filling material.
A component carrier having ... |
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Invention
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Method for estimating a viscosity curve of a polymeric material. The invention relates to a metho... |
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Invention
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Method to define a production and/or application and/or use of a polymeric material. The inventio... |
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Invention
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Component carrier with surface mounted components connected by high density connection region.
A... |
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Invention
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Component carrier with stack-stack connection for connecting components.
A component carrier inc... |
2021
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Invention
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Component carrier for waveguide applications.
A component carrier which includes a stack having ... |
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Invention
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Component carrier with electronic components and thermally conductive blocks on both sides.
A co... |
2018
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G/S
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Electrical circuits and circuit boards; Parts for circuit boards; Circuit boards for connecting a... |
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G/S
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Electrical circuits and circuit boards; Parts of integrated circuit cards; Apparatus and instrume... |
2017
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G/S
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Substrates as carriers of semiconductors. Printing apparatus for circuit boards; Photolithographi... |
2013
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G/S
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Machines and machine tools, in particular gas-operated
soldering apparatus, soldering irons and ... |
2010
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G/S
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Printed circuits, chips (integrated circuits), circuit
boards, multi-layered circuit boards, fle... |
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G/S
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Printed circuits, chips (integrated circuits), circuit boards, multi-layered circuit boards, flex... |
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G/S
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Printed circuits, Circuit boards,Multi-layered printed circuit boards, Flexible circuit boards,Se... |
2009
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G/S
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Machines and machine tools, especially gas operated
soldering apparatus, soldering irons and sol... |