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2022
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Invention
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Fluorine-containing resin copper-clad laminate and multi-layer circuit board. Provided in the pre... |
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Invention
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Non-woven fabric prepreg, metal-foil-clad plate and printed circuit board. The present invention ... |
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Invention
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Low dielectric loss non-woven fabric, preparation method thereof and use thereof.
Provided are a... |
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Invention
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Resin composition and use thereof. The present invention provides a resin composition and use the... |
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Invention
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Resin composition and use thereof. ff, better drilling processability and higher electrical stren... |
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Invention
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Resin composition and application thereof. The present invention provides a resin composition and... |
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Invention
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Resin composition and application thereof. Provided by the present invention a resin composition ... |
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Invention
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Fluorine-containing resin-based resin composition and application thereof. The present invention ... |
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2021
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Invention
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Thermosetting resin composition and application thereof.
The present invention relates to a ther... |
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Invention
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Resin composition, resin adhesive film, and application thereof.
Resin composition, resin adhesi... |
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Invention
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Resin composition and resin film, prepreg, laminated board, copper-clad board and printed circuit... |
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Invention
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Thermosetting resin composition and application thereof. The present invention relates to a therm... |
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Invention
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Resin composition, resin adhesive film, and application thereof. Provided are a resin composition... |
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Invention
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Resin composition and adhesive film and cover film comprising same. The present invention provide... |
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Invention
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Circuit material and circuit board containing the same. The present application provides a circui... |
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Invention
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Resin composition, and prepreg and circuit material using the same. The present application provi... |
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Invention
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Laminate coated with asymmetric metal foils, and printed circuit board including same.
A laminat... |
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Invention
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Laminate coated with asymmetric metal foils, and printed circuit board including same. Provided a... |
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Invention
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Thermosetting resin composition, and prepreg and copper clad laminate using same. kff; the heat r... |
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Invention
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Resin composition and use thereof. The present invention relates to a resin composition and the u... |
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Invention
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Halogen-free flame-retardant resin composition and application thereof. The present invention rel... |
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Invention
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Thermosetting resin composition, resin adhesive liquid containing same, prepreg, laminate, copper... |
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2020
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Invention
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Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, la... |
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Invention
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Thermosetting resin composition, and prepreg, laminate, and high-frequency circuit substrate cont... |
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Invention
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Fluorine-containing resin composition and resin glue solution comprising same, fluorine-containin... |
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Invention
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Resin composition and resin glue solution containing same, prepreg, laminated board, copper-clad ... |
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Invention
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Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising same.
A m... |
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Invention
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Maleimide-modified active ester, preparation method therefor and use thereof. Provided are a male... |
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Invention
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Magnetic dielectric resin composition and application thereof. Provided are a magnetic dielectric... |
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Invention
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Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising same. A ma... |
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Invention
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Resin composition and prepreg sheet using same, and insulating plate. The present invention relat... |
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Invention
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Modified maleimide compound, preparation method therefor and use thereof. The present invention r... |
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Invention
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Thermosetting resin composition, and prepreg, laminate and printed circuit board using same. Prov... |
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Invention
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Thermosetting resin composition and prepreg, laminate and printed circuit board using same.
Prov... |
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Invention
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Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board usin... |
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Invention
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Thermosetting resin composition and prepreg, laminate and printed circuit board using same. Provi... |
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Invention
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Copper clad laminate and printed-circuit board.
A copper clad laminate and a printed-circuit boa... |
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2019
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Invention
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Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board.
A res... |
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Invention
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Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board. Provid... |
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Invention
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Active ester with amino groups at two ends, preparation method therefor, thermosetting resin comp... |
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Invention
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Resin composition, prepreg containing same, laminate, and printed circuit board.
The present dis... |
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Invention
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Resin composition, prepreg containing same, and laminate board and printed circuit board.
The pr... |
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Invention
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Thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed ci... |
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2018
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Invention
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Resin composition, prepreg, laminate and metal foil-clad laminate.
An epoxy resin composition, a... |
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Invention
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Resin composition, prepreg for printed circuit and metal-coated laminate.
Provided is a resin co... |
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Invention
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Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof. Prov... |
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2017
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Invention
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Thermosetting resin composition, and prepreg and metal foil clad laminate made therefrom.
Thermo... |
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2011
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G/S
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Copper clad laminates for use in the manufacture of printed circuit boards |
