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2023
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G/S
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Humidifiers; Air purifiers; Light projectors; Kettles, electric; Heating cartridges; Electric spa... |
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2020
|
G/S
|
Brushes for vacuum cleaners; Vacuum cleaners; Vacuum cleaners for household purposes; Vacuum clea... |
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G/S
|
Air pumps, hand-operated; Battery-powered animal nail grinders; Can openers, non-electric; Cheese... |
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G/S
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Skin cleansing lotion; Bath oils; Hair shampoo; Shampoos for babies; Perfumed soaps; Cosmetic soa... |
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G/S
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Electric food blenders; Beer pumps; Bottle washing machines; Capping machines; Carpet cleaning ma... |
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2017
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G/S
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Fund investments; Financial evaluation [insurance, banking, real estate]; Financing services; Cre... |
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2016
|
Invention
|
Intelligent switch and intelligent home system using the same.
Disclosed is an intelligent switc... |
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Invention
|
Camera |
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2013
|
G/S
|
Counters; quantity indicators; money counting and sorting
machines; electronic cash registers; c... |
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G/S
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Measuring apparatus, namely, counters and apparatus for indicating and measuring quantity; money ... |
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Invention
|
Method and device for generating floating-point values. A floating-point value can represent a nu... |
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Invention
|
Method of making a floating gate non-volatile memory (nvm) with breakdown prevention.
A method o... |
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Invention
|
Non-volatile memory (nvm) and high-k and metal gate integration using gate-last methodology. A me... |
|
|
Invention
|
Non-volatile memory (nvm) and high-k and metal gate integration using gate-first methodology. A m... |
|
|
Invention
|
Mold locks for laminate substrates.
A mechanism is provided by which delamination of a substrate... |
|
|
Invention
|
Electronic component package and method for forming same. An electronic component package include... |
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|
Invention
|
Data processing system with cache linefill buffer and method of operation. When data in first and... |
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|
Invention
|
Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolato... |
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|
Invention
|
Devices and stacked microelectronic packages with in-trench package surface conductors and method... |
|
|
Invention
|
3d device packaging using through-substrate pillars. A method for 3D device packaging utilizes th... |
|
|
Invention
|
System and method for enabling maximum performance operation within an extended ambient temperatu... |
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|
Invention
|
Memory having one time programmable (otp) elements and a method of programming the memory. A meth... |
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|
Invention
|
Package encapsulant relief feature. A microelectronic device package including a package substrat... |
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|
Invention
|
Temperature dependent biasing for leakage power reduction. Temperature dependent biasing for leak... |
|
|
Invention
|
Non-volatile memory (nvm) with dynamically adjusted reference current. A sense amplifier is confi... |
|
|
Invention
|
Stacked protection devices and related fabrication methods. Protection device structures and rela... |
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|
Invention
|
Squib driver diagnostic circuit and method. A diagnostic circuit is provided that includes a FET ... |
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|
Invention
|
System-in-packages containing embedded surface mount devices and methods for the fabrication ther... |
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|
Invention
|
Semiconductor device and lead frame with interposer.
A semiconductor device includes a lead fram... |
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|
Invention
|
Heat spreader for integrated circuit device. A BGA type packaged integrated circuit (IC) die has ... |
|
|
Invention
|
Side vented pressure sensor device. A semiconductor sensor device has a pressure sensing die and ... |
|
|
Invention
|
System and method for data synchronization across digital device interfaces. A system for synchro... |
|
|
Invention
|
Recessed semiconductor die stack.
Recessed semiconductor die stacks. In some embodiments, a semi... |
|
|
Invention
|
Protection method for data information about electronic device and protection circuit therefor. D... |
|
|
Invention
|
Universal spi (serial peripheral interface). A Universal SPI Interface is provided that is compat... |
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|
Invention
|
Methods for forming contact landing regions in split-gate non-volatile memory (nvm) cell arrays. ... |
|
|
Invention
|
Non-volatile memory (nvm) cell and high-k and metal gate transistor integration. A method of maki... |
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|
Invention
|
Method of forming different voltage devices with high-k metal gate. A method and apparatus are de... |
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|
Invention
|
Package-on-package semiconductor sensor device.
A semiconductor sensor device has a MCU die and ... |
|
|
Invention
|
Copper pillar bump and flip chip package using same. Electrically conductive pillars with a solde... |
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|
Invention
|
Multiple sense axis mems gyroscope having a single drive mode. A gyroscope includes a first drive... |
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|
Invention
|
Edge coupling of semiconductor dies. Edge coupling of semiconductor dies. In some embodiments, a ... |
|
|
Invention
|
Wafer-level gate stress testing. A method of testing a semiconductor device includes forming a te... |
|
|
Invention
|
Single port memory that emulates dual port memory. th address in the RAM banks and defining k sta... |
|
|
Invention
|
Method and circuit for controlling turnoff of a semiconductor switching element. A circuit perfor... |
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|
Invention
|
Split gate nanocrystal memory integration. A process integration is disclosed for fabricating non... |
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|
Invention
|
Systems and methods for secure boot rom patch. A data processing system includes a boot read only... |
|
|
Invention
|
Electro-mechanical oscillator and common-mode detection circuit. A multi-mass resonator and a com... |
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|
Invention
|
Microelectronic packages containing opposing devices and methods for the fabrication thereof. Mic... |
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|
Invention
|
Negative voltage measurement. A method of measuring a negative voltage using a device including a... |
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|
Invention
|
Sequential wafer bonding. Embodiments of methods of fabricating a sensor device includes attachin... |
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|
Invention
|
Method for forming a packaged semiconductor device. A method of fabricating a packaged semiconduc... |
|
|
Invention
|
Integrated split gate non-volatile memory cell and logic structure. A method of making a semicond... |
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|
Invention
|
Solder wettable flanges and devices and systems incorporating solder wettable flanges. An embodim... |
|
|
Invention
|
Inertial sensor with trim capacitance and method of trimming offset.
An inertial sensor (20) inc... |
|
|
Invention
|
Method and apparatus for beam control with optical mems beam waveguide. A high density, low power... |
|
|
Invention
|
Apparatus and method for monitoring operation of an insulated gate bipolar transistor. Operation ... |
|
2011
|
Invention
|
Semiconductor device and related fabrication methods. Semiconductor device structures and related... |
